US2014106106A1PendingUtilityA1
Dicing film with protecting film
Est. expiryMar 11, 2031(~4.5 yrs left)· nominal 20-yr term from priority
H10W 72/5524H10W 72/5522H10W 99/00H10W 74/00H10W 72/073H10W 72/0198H10W 72/884H10W 90/756H10W 90/754H10W 72/075H10W 72/07337H10W 72/07338H10W 72/351H10W 72/353H10W 72/354H10W 72/352H10W 72/325H10W 72/01336H10W 90/734H10W 90/736H10P 72/7438H10P 72/7416H10P 72/744H10W 72/5525H10P 72/7402H10P 95/00B32B 27/365C09J 2203/326B32B 27/36B32B 27/20B32B 7/12C09J 7/385B32B 2457/14B32B 27/281Y10T428/1467Y10T428/24802Y10T428/24942Y10T428/1471H01L 21/6836
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Claims
Abstract
The present invention provides a dicing film with a protecting film that enables to paste a dicing film to a semiconductor wafer without a shift in position while reducing a downtime. There is provided a dicing film with a protecting film in which a dicing film and a protecting film are laminated, wherein the difference between the transmittance of the protecting film and the transmittance of the dicing film with a protecting film at a portion of the dicing film where light for detecting a film transmits first is 20% or more in a wavelength of 600 to 700 nm.
Claims
exact text as granted — not AI-modified1 . A dicing film with a protecting film in which a dicing film and a protecting film are laminated, wherein
the difference between the transmittance of the protecting film and the transmittance of the dicing film with a protecting film at a portion of the dicing film where light for detecting a film transmits first is 20% or more in a wavelength of 600 to 700 nm.
2 . The dicing film with a protecting film according to claim 1 , wherein
the dicing film has a base and an adhesive layer that is laminated on the base, and the base is embossed.
3 . The dicing film with a protecting film according to claim 1 , wherein
the dicing film has a base and a adhesive layer that is laminated on the base, and the base is colored.
4 . The dicing film with a protecting film according to claim 1 , wherein
the transmittance of the dicing film with a protecting film at the portion of the dicing film where the light for detecting a film transmits first is 0 to 70%.
5 . The dicing film with a protecting film according to claim 1 , wherein
the transmittance of the protecting film is 75 to 100%.
6 . The dicing film with a protecting film according to claim 1 , wherein
the dicing film has a base and an adhesive layer that is laminated on the base and a die bond film is laminated on the adhesive layer of the dicing film.
7 . The dicing film with a protecting film according to claim 1 , wherein the dicing film has a base and an adhesive layer, and a printing layer laminated between the adhesive layer and the base.Join the waitlist — get patent alerts
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