Inventor · disambiguated record
Yudo Sugawara
Also filed as: SUGAWARA YUDO
7 granted patents·4 pending applications·48 citations·filing 2007–2022
80Inventor score
Top patents by PatentIndex Score
11 records- 0190US8936050B2Lid opening and closing deviceSUGAWARA YUDO·Filed 2012·Granted Jan 20, 2015·22 cites·6 claims
- 0289US9082807B2Lid opening and closing deviceSUGAWARA YUDO·Filed 2012·Granted Jul 14, 2015·20 cites·8 claims
- 0368US8452540B2Earthquake damage spread reducing method and earthquake damage spread reducing system for use in semiconductor manufacturing apparatusSUGAWARA YUDO·Filed 2007·Granted May 28, 2013·3 cites·14 claims
- 0468US8190277B2Method for limiting expansion of earthquake damage and system for limiting expansion of earthquake damage for use in semiconductor manufacturing apparatusSUGAWARA YUDO·Filed 2008·Granted May 29, 2012·3 cites·4 claims
- 0553US2023193464A1Substrate processing apparatus and substrate removal methodTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 0650US8692208B2Ion supply device and workpiece processing system provided with the sameTOKYO ELECTRON LTD·Filed 2013·Granted Apr 8, 2014·0 cites·4 claims
- 0749US2013042808A1Film crack detection apparatus and film forming apparatusTOKYO ELECTRON LTD·Filed 2012·Application pending·0 cites
- 0848US11869798B2Deposition apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Jan 9, 2024·0 cites·13 claims
- 0946US8450700B2Ion supply deviceSUGAWARA YUDO·Filed 2011·Granted May 28, 2013·0 cites·4 claims
- 1046US2014020626A1Film crack detecting apparatus and film forming apparatusTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 1136US2020126829A1Maintenance control method of controlling maintenance of processing device and control deviceTOKYO ELECTRON LTD·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yudo Sugawara files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →