Inventor · disambiguated record
Yuki Suto
Also filed as: SUTO YUKI
16 granted patents·7 pending applications·25 citations·filing 2009–2024
89Inventor score
Top patents by PatentIndex Score
23 records- 0174US9117982B2Light-emitting device including transparent resin with curved surface arranged at side facing light-emitting diode elementCITIZEN ELECTRONICS·Filed 2014·Granted Aug 25, 2015·3 cites·6 claims
- 0268US9983448B2Wiring body assembly, structure with conductor layer, and touch sensorFUJIKURA LTD·Filed 2016·Granted May 29, 2018·2 cites·5 claims
- 0366US11756939B2Light emitting element with particular phosphorsCITIZEN ELECTRONICS·Filed 2022·Granted Sep 12, 2023·0 cites·17 claims
- 0462US12092675B2Evaluation device of radio communication moduleFUJIKURA LTD·Filed 2022·Granted Sep 17, 2024·0 cites·5 claims
- 0561US10254184B2Semiconductor pressure sensorFUJIKURA LTD·Filed 2014·Granted Apr 9, 2019·1 cites·9 claims
- 0658US8330268B2Semiconductor package and manufacturing method thereofSUTO YUKI·Filed 2009·Granted Dec 11, 2012·3 cites·14 claims
- 0757US8836208B2Light-emitting device including LED element whose upper surface is free from white resin and method of manufacturing the sameKAZUYA ISHIHARA·Filed 2012·Granted Sep 16, 2014·2 cites·9 claims
- 0855US2025158295A1Antenna moduleFUJIKURA LTD·Filed 2024·Application pending·0 cites
- 0954US11342312B2Light emitting element with particular phosphorsCITIZEN ELECTRONICS·Filed 2019·Granted May 24, 2022·0 cites·5 claims
- 1053US2024250405A1Wireless moduleFUJIKURA LTD·Filed 2024·Application pending·0 cites
- 1152US2024128086A1Method of processing waferDISCO CORP·Filed 2023·Application pending·0 cites
- 1250USD731342SPressure sensorFUJIKURA LTD·Filed 2014·Granted Jun 9, 2015·7 cites·1 claims
- 1349US2021260926A1Pneumatic Tire and Method for Manufacturing Pneumatic TireYOKOHAMA RUBBER CO LTD·Filed 2019·Application pending·0 cites
- 1446US10424562B2Light emitting device with phosphorsCITIZEN ELECTRONICS·Filed 2015·Granted Sep 24, 2019·0 cites·3 claims
- 1544US12463670B2Output control method of radio communication module, manufacturing method of radio communication module and output control unit of radio communication moduleFUJIKURA LTD·Filed 2022·Granted Nov 4, 2025·0 cites·5 claims
- 1644USD729084SPressure sensorFUJIKURA LTD·Filed 2014·Granted May 12, 2015·5 cites·1 claims
- 1738US2020053879A1Wiring body and wiring body assemblyFUJIKURA LTD·Filed 2018·Application pending·0 cites
- 1838US2020064971A1Wiring body assembly, wiring board, and touch sensorFUJIKURA LTD·Filed 2017·Application pending·0 cites
- 1937US9773954B2Light emitting device and method of manufacturing light emitting deviceCITIZEN ELECTRONICS·Filed 2015·Granted Sep 26, 2017·0 cites·8 claims
- 2037US2020301542A1Wiring body assembly, wiring structure, and touch sensorFUJIKURA LTD·Filed 2017·Application pending·0 cites
- 2135US11003052B2Mobile deviceCITIZEN ELECTRONICS·Filed 2017·Granted May 11, 2021·0 cites·9 claims
- 2234USD741734SPressure sensorFUJIKURA LTD·Filed 2014·Granted Oct 27, 2015·2 cites·1 claims
- 2327US8530979B2Semiconductor package and method for manufacturing the sameOGURA SHINGO·Filed 2010·Granted Sep 10, 2013·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →