Inventor · disambiguated record
Yukio Takigawa
Also filed as: TAKIGAWA YUKIO
19 granted patents·2 pending applications·308 citations·filing 1977–2009
95Inventor score
Top patents by PatentIndex Score
21 records- 0185US5406598ASystem for monitoring power of nuclear reactorTOSHIBA KK·Filed 1993·Granted Apr 11, 1995·31 cites·15 claims
- 0284US7211519B2Method for manufacturing semiconductor deviceFUJITSU LTD·Filed 2005·Granted May 1, 2007·12 cites·16 claims
- 0375US6278192B1Semiconductor device with encapsulating material composed of silicaFUJITSU LTD·Filed 1999·Granted Aug 21, 2001·45 cites·25 claims
- 0474US7811936B2Method of producing semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Oct 12, 2010·4 cites·11 claims
- 0574US6565419B1Method of removing particles from stage and cleaning plateADVANTEST CORP·Filed 2000·Granted May 20, 2003·17 cites·12 claims
- 0673US6338903B1Resin composition for semiconductor encapsulation, method and apparatus for producing the composition, as well as semiconductor device using the compositionFUJITSU LTD·Filed 2000·Granted Jan 15, 2002·19 cites·10 claims
- 0773US5844309AAdhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the compositionFUJITSU LTD·Filed 1996·Granted Dec 1, 1998·46 cites·14 claims
- 0868US8675808B2Natural circulation type boiling water reactorABE NOBUAKI·Filed 2006·Granted Mar 18, 2014·2 cites·10 claims
- 0967US7709394B2Substrate processing method and apparatus fabrication process of a semiconductor deviceTOKYO ELECTRON LTD·Filed 2007·Granted May 4, 2010·2 cites·8 claims
- 1064US5659004AEpoxy resin compositionFUJITSU LTD·Filed 1995·Granted Aug 19, 1997·31 cites·19 claims
- 1163US6943115B2Semiconductor device and method of manufacture thereofFUJITSU LTD·Filed 2002·Granted Sep 13, 2005·10 cites·16 claims
- 1263US6656996B2Semiconductor-sealing resin composition and semiconductor device using itSUMITOMO BAKELITE CO·Filed 2000·Granted Dec 2, 2003·11 cites·12 claims
- 1362US6693046B2Method of manufacturing semiconductor device having multilevel wiringFUJITSU LTD·Filed 2003·Granted Feb 17, 2004·17 cites·20 claims
- 1454US7481264B2Steam condenserTOSHIBA KK·Filed 2005·Granted Jan 27, 2009·2 cites·19 claims
- 1554US6361879B1Semiconductor device and method for fabricating it, and semiconductor sealing resin compositionTORAY INDUSTRIES·Filed 1999·Granted Mar 26, 2002·18 cites·32 claims
- 1654US4319959AMethod of supervising the channel stability in reactor cores of nuclear reactorsTOKYO SHIBAURA ELECTRIC CO·Filed 1980·Granted Mar 16, 1982·9 cites·7 claims
- 1753US5763540AEpoxy resin composition for encapsulating semiconductorFUJITSU LTD·Filed 1995·Granted Jun 9, 1998·19 cites·4 claims
- 1847US2010007020A1Semiconductor device and method of manufacturing the sameFUJITSU MICROELECTRONICS LTD·Filed 2009·Application pending·0 cites
- 1945US4115516AMethod of treating exhaust gas discharged from nitric acid plantMITSUBISHI CHEM IND·Filed 1977·Granted Sep 19, 1978·12 cites·6 claims
- 2043US7390741B2Method for fabricating semiconductor deviceFUJITSU LTD·Filed 2004·Granted Jun 24, 2008·1 cites·10 claims
- 2143US2007148953A1Method for fabricating semiconductor device and method for fabricating magnetic headFUJITSU LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →