Inventor · disambiguated record
Yu-Tai Tsai
Also filed as: TSAI YU TAI
8 granted patents·1 pending application·83 citations·filing 1993–2025
86Inventor score
Files withUNITED MICROELECTRONICS CORP5IND TECH RES INST2MEDIATEK INC1TAIWAN SEMICONDUCTOR MFG CO LTD1
Top patents by PatentIndex Score
9 records- 0180US2025357127A1In-Situ Tungsten for Gate Stack of Multigate DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0264US11848750B2Radio frequency interference mitigation with adaptive local oscillatorMEDIATEK INC·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 0359US5356656AMethod for manufacturing flexible amorphous silicon solar cellIND TECH RES INST·Filed 1993·Granted Oct 18, 1994·21 cites·6 claims
- 0458US6204096B1Method for reducing critical dimension of dual damascene process using spin-on-glass processUNITED MICROELECTRONICS CORP·Filed 1999·Granted Mar 20, 2001·24 cites·12 claims
- 0549US6255162B1Method of gap fillingUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jul 3, 2001·15 cites·16 claims
- 0644US5693745AMethod for synthesizing polyamic acid for manufacturing flexible amorphous silicon solar cellIND TECH RES INST·Filed 1996·Granted Dec 2, 1997·11 cites·13 claims
- 0737US6239024B1Method of filling gap with dielectricsUNITED MICROELECTRONICS CORP·Filed 1999·Granted May 29, 2001·7 cites·22 claims
- 0831US6284645B1Controlling improvement of critical dimension of dual damasceue process using spin-on-glass processUNITED MICROELECTRONICS CORP·Filed 1999·Granted Sep 4, 2001·3 cites·10 claims
- 0930US6248662B1Method of improving gap filling characteristics of dielectric layer by implantationUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jun 19, 2001·2 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Yu-Tai Tsai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →