Inventor · disambiguated record
Yutaka Tsukada
Also filed as: TSUKADA YUTAKA
26 granted patents·1 pending application·843 citations·filing 1983–2023
97Inventor score
Top patents by PatentIndex Score
27 records- 0195US5451721AMultilayer printed circuit board and method for fabricating sameIBM·Filed 1991·Granted Sep 19, 1995·166 cites·16 claims
- 0293US6985362B2Printed circuit board and electronic package using sameIBM·Filed 2001·Granted Jan 10, 2006·70 cites·5 claims
- 0393US5662987AMultilayer printed wiring board and method of making sameIBM·Filed 1996·Granted Sep 2, 1997·112 cites·8 claims
- 0492US5956843AMultilayer printed wiring board and method of making sameIBM·Filed 1997·Granted Sep 28, 1999·83 cites·4 claims
- 0591US9354408B2Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguideIBM·Filed 2013·Granted May 31, 2016·12 cites·5 claims
- 0687US5355580AMethod for replacing semiconductor chipsIBM·Filed 1992·Granted Oct 18, 1994·82 cites·7 claims
- 0786US6378201B1Method for making a printed circuit boardIBM·Filed 1995·Granted Apr 30, 2002·70 cites·1 claims
- 0883US8129623B2Resin film, adhesive sheet, circuit board, and electronic apparatusNAGASAWA TADASHI·Filed 2007·Granted Mar 6, 2012·7 cites·15 claims
- 0981US8971678B2Spacer resin pattern helping to reduce optical coupling loss in optical waveguide for light-emitting element or light-receiving element on semiconductorIBM·Filed 2013·Granted Mar 3, 2015·5 cites·18 claims
- 1080US5883335AElectrical connection substrate having a through hole for connecting a chip to an opposite surface of the substrateIBM·Filed 1996·Granted Mar 16, 1999·67 cites·16 claims
- 1178US9772462B2Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguideIBM·Filed 2016·Granted Sep 26, 2017·2 cites·10 claims
- 1273US6273328B1Solder bump forming method and apparatusIBM·Filed 2000·Granted Aug 14, 2001·22 cites·7 claims
- 1371US12378711B2Sewing management systemJUKI KK·Filed 2023·Granted Aug 5, 2025·0 cites·10 claims
- 1470US8446734B2Circuit board and mounting structureHAYASHI KATSURA·Filed 2007·Granted May 21, 2013·6 cites·4 claims
- 1570US5488200AInterconnect structure with replaced semiconductor chipsIBM·Filed 1994·Granted Jan 30, 1996·35 cites·30 claims
- 1669US5878942ASoldering method and soldering apparatusIBM·Filed 1996·Granted Mar 9, 1999·40 cites·13 claims
- 1762US6551697B2Printed circuit board, method of making same, and photomask for use in the methodIBM·Filed 2001·Granted Apr 22, 2003·1 cites·8 claims
- 1861US4543211AConjugate having cytotoxicity and process for the preparation thereofTEIJIN LTD·Filed 1983·Granted Sep 24, 1985·19 cites·11 claims
- 1960US8045829B2Optical waveguide member, optical wiring board, optical wiring module and method for manufacturing optical waveguide member and optical wiring boardKYOCERA CORP·Filed 2006·Granted Oct 25, 2011·2 cites·13 claims
- 2056US6667559B2Ball grid array module and method of manufacturing sameIBM·Filed 2002·Granted Dec 23, 2003·6 cites·19 claims
- 2151US6427898B2Solder bump forming method and apparatusIBM·Filed 2001·Granted Aug 6, 2002·5 cites·8 claims
- 2251US5776662AMethod for fabricating a chip carrier with migration barrier, and resulating chip carrierIBM·Filed 1996·Granted Jul 7, 1998·17 cites·18 claims
- 2346US8284557B2Circuit board, mounting structure, and method for manufacturing circuit boardTSUKADA YUTAKA·Filed 2008·Granted Oct 9, 2012·0 cites·9 claims
- 2438US5784781AManufacturing process for organic chip carrierIBM·Filed 1995·Granted Jul 28, 1998·7 cites·9 claims
- 2538US2004164060A1Hole drilling method and apparatusIBM·Filed 2004·Application pending·0 cites
- 2631US5444299AElectronic package with lead wire connectionsIBM·Filed 1994·Granted Aug 22, 1995·5 cites·9 claims
- 2728US5470796AElectronic package with lead wire connections and method of making sameIBM·Filed 1995·Granted Nov 28, 1995·2 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →