Inventor · disambiguated record

Yu-Cheng Tung

Also filed as: TUNG YU- CHENG

207 granted patents·44 pending applications·663 citations·filing 2002–2025

99Inventor score

Technology areasH10P H10W H10D H01L H10B

Files withUNITED MICROELECTRONICS CORP164 FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD77 TUNG YU-CHENG4 CHUNGHWA PICTURE TUBES LTD2 WINBOND ELECTRONICS CORP2

Top patents by PatentIndex Score

251 records

0199US9899267B1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 20, 2018·81 cites·12 claims
0298US9496361B1Selectively deposited metal gates and method of manufacturing thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 15, 2016·25 cites·20 claims
0398US9406521B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 2, 2016·21 cites·10 claims
0497US9722093B1Oxide semiconductor transistor and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 1, 2017·47 cites·13 claims
0596US9679819B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 13, 2017·14 cites·19 claims
0696US9660022B2Semiconductive device with a single diffusion break and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 23, 2017·17 cites·13 claims
0796US9530851B1Semiconductor device and manufacturing methods thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 27, 2016·15 cites·20 claims
0896US9397008B1Semiconductor device and manufacturing method of conductive structure in semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jul 19, 2016·14 cites·15 claims
0995US10504791B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 10, 2019·9 cites·20 claims
1095US9859283B1Semiconductor memory structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 2, 2018·10 cites·18 claims
1195US9748139B1Method of fabricating dual damascene structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 29, 2017·14 cites·8 claims
1295US9570339B2Semiconductor structure and process thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 14, 2017·11 cites·6 claims
1395US9543211B1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 10, 2017·15 cites·17 claims
1495US8664060B2Semiconductor structure and method of fabricating the sameLIU AN-CHI·Filed 2012·Granted Mar 4, 2014·22 cites·20 claims
1594US11825644B2Semiconductor memory deviceFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Nov 21, 2023·2 cites·12 claims
1694US11600622B2Method of forming semiconductor memory device comprises a bit line having a plurality of pins extending along a direction being perpendicular to a substrateFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Mar 7, 2023·2 cites·18 claims
1794US10355019B1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 16, 2019·11 cites·15 claims
1894US10354876B1Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 16, 2019·10 cites·20 claims
1994US10205005B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 12, 2019·8 cites·9 claims
2094US9607892B2Method for forming a two-layered hard mask on top of a gate structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Mar 28, 2017·9 cites·7 claims
2194US9378973B1Method of using sidewall image transfer process to form fin-shaped structuresUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 28, 2016·10 cites·11 claims
2293US11665885B2Semiconductor memory deviceFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted May 30, 2023·2 cites·11 claims
2393US11380754B2Manufacturing method of semiconductor device and semiconductor deviceFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Jul 5, 2022·2 cites·14 claims
2493US10056463B2Transistor and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 21, 2018·13 cites·18 claims
2593US10043807B1Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 7, 2018·9 cites·19 claims
2693US9837417B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Dec 5, 2017·6 cites·20 claims
2793US9490341B2Semiconductor device having metal gate and method for manufacturing semiconductor device having metal gateUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 8, 2016·8 cites·13 claims
2893US8546202B2Manufacturing method for semiconductor structuresTUNG YU-CHENG·Filed 2011·Granted Oct 1, 2013·21 cites·15 claims
2992US11557645B2Semiconductor memory device and method of forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Jan 17, 2023·3 cites·20 claims
3092US10332884B2FinFET semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jun 25, 2019·13 cites·5 claims
3192US10164039B2Semiconductor device having metal gateUNITED MICROELECTRONICS CORP·Filed 2016·Granted Dec 25, 2018·7 cites·7 claims
3291US11818880B2Semiconductor structure including capacitor and method for forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2022·Granted Nov 14, 2023·1 cites·20 claims
3391US10600790B2Manufacturing method of semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Mar 24, 2020·6 cites·19 claims
3491US10332877B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 25, 2019·7 cites·13 claims
3591US10153353B1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 11, 2018·6 cites·20 claims
3691US10062613B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 28, 2018·6 cites·10 claims
3791US9882054B2FinFET with merged, epitaxial source/drain regionsUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 30, 2018·6 cites·11 claims
3891US9576859B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 21, 2017·6 cites·18 claims
3990US10580864B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Mar 3, 2020·5 cites·15 claims
4090US10068969B2Nanowire transistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 4, 2018·5 cites·6 claims
4190US9385236B1Fin shaped semiconductor device structures having tipped end shape and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jul 5, 2016·9 cites·17 claims
4289US10381439B2Nanowire transistor having two spacers between gate structure and source/drain structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 13, 2019·4 cites·19 claims
4389US10170362B2Semiconductor memory device with bit line contact structure and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 1, 2019·5 cites·7 claims
4489US9780193B2Device with reinforced metal gate spacer and method of fabricatingUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 3, 2017·6 cites·6 claims
4588US9985035B1Semiconductor memory structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 29, 2018·4 cites·19 claims
4688US9054187B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jun 9, 2015·8 cites·12 claims
4787US11784184B2Semiconductor memory deviceFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Oct 10, 2023·1 cites·20 claims
4887US10312353B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 4, 2019·3 cites·9 claims
4987US9496182B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Nov 15, 2016·7 cites·14 claims
5087US9466564B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 11, 2016·4 cites·11 claims

Showing the top 50 of 251 patent records by PatentIndex Score.

Join the waitlist — get patent alerts

Get an alert when Yu-Cheng Tung files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →