Inventor · disambiguated record
Yueh-Ming Tung
Also filed as: TUNG YUEH-MING
6 granted patents·11 pending applications·72 citations·filing 2006–2024
80Inventor score
Top patents by PatentIndex Score
17 records- 0187US7948772B2Memory card with electrostatic discharge protection and manufacturing method thereofORIENT SEMICONDUCTOR ELECT LTD·Filed 2009·Granted May 24, 2011·34 cites·19 claims
- 0285US11355356B1Manufacturing method of semiconductor package comprising heat spreaderORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2021·Granted Jun 7, 2022·3 cites·4 claims
- 0371USD647097SMemory cardORIENT SEMICONDUCTOR ELECT LTD·Filed 2010·Granted Oct 18, 2011·21 cites·1 claims
- 0462USD647096SMemory cardORIENT SEMICONDUCTOR ELECT LTD·Filed 2010·Granted Oct 18, 2011·14 cites·1 claims
- 0556US2025125216A1Die and manufacturing method thereof as well as semiconductor package with the sameORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2024·Application pending·0 cites
- 0654US2025062265A1Semiconductor package and manufacturing method thereofORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2024·Application pending·0 cites
- 0753US2025062281A1Semiconductor package and manufacturing method thereofORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2024·Application pending·0 cites
- 0848US2009253230A1Method for manufacturing stack chip package structureTUNG YUEH-MING·Filed 2009·Application pending·0 cites
- 0947US2009189295A1Stack chip package structure and manufacturing method thereofORIENT SEMICONDUCTOR ELECT LTD·Filed 2008·Application pending·0 cites
- 1046US11462454B2Semiconductor package comprising heat spreader and manufacturing method thereofORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2021·Granted Oct 4, 2022·0 cites·6 claims
- 1145US11462485B2Electronic package including electromagnetic shielding structure and method of manufactureORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2021·Granted Oct 4, 2022·0 cites·11 claims
- 1243US2021005574A1Semiconductor package and manufacturing method thereofORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2020·Application pending·0 cites
- 1341US2008113472A1Film and chip packaging process using the sameTUNG YUEH MING·Filed 2007·Application pending·0 cites
- 1439US2007205493A1Semiconductor package structure and method for manufacturing the sameORIENT SEMICONDUCTOR ELECT LTD·Filed 2006·Application pending·0 cites
- 1539US2022285217A1Wafer thinning methodORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2021·Application pending·0 cites
- 1639US2008007932A1Memory card with electrostatic discharge protectionORIENT SEMICONDUCTOR ELECT LTD·Filed 2006·Application pending·0 cites
- 1731US2012038839A1Micro projector moduleTUNG YUEH MING·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →