Inventor · disambiguated record
Yu-Piao Wang
Also filed as: WANG YU · WANG YU-PIAO
34 granted patents·6 pending applications·132 citations·filing 1993–2023
96Inventor score
Files withIV TECH CO LTD9WANG YU-PIAO8UNIV WASHINGTON STATE6UNITED MICROELECTRONICS CORP4PROMOS TECHNOLOGIES INC3
Top patents by PatentIndex Score
40 records- 0196US8398461B2Polishing method, polishing pad and polishing systemWANG YU-PIAO·Filed 2010·Granted Mar 19, 2013·23 cites·50 claims
- 0295US8870626B2Polishing pad, polishing method and polishing systemWANG YU-PIAO·Filed 2012·Granted Oct 28, 2014·17 cites·51 claims
- 0390USRE46648EPolishing pad, polishing method and method of forming polishing padIV TECH CO LTD·Filed 2015·Granted Dec 26, 2017·3 cites·24 claims
- 0483US11872671B2Polishing pad and polishing methodIV TECH CO LTD·Filed 2022·Granted Jan 16, 2024·0 cites·19 claims
- 0582US8496512B2Polishing pad, polishing method and method of forming polishing padIV TECHNOLOGIES CO LTD·Filed 2012·Granted Jul 30, 2013·3 cites·23 claims
- 0681US6465348B1Method of fabricating an MOCVD titanium nitride layer utilizing a pulsed plasma treatment to remove impuritiesUNITED MICROELECTRONICS CORP·Filed 2001·Granted Oct 15, 2002·25 cites·15 claims
- 0773US11033844B2Stabilized protein fiber air filter materials and methodsUNIV WASHINGTON STATE·Filed 2018·Granted Jun 15, 2021·1 cites·19 claims
- 0873US10525398B2Protein nanofiber air filter materials and methodsUNIV WASHINGTON STATE·Filed 2018·Granted Jan 7, 2020·1 cites·19 claims
- 0973US7597609B2Substrate retaining ring for CMPIV TECHNOLOGIES CO LTD·Filed 2006·Granted Oct 6, 2009·4 cites·20 claims
- 1072US11524389B2Polishing pad and polishing methodIV TECH CO LTD·Filed 2018·Granted Dec 13, 2022·0 cites·13 claims
- 1171US12224082B2Stress engineered microspring for cryogenic superconducting circuitsPALO ALTO RES CT INC·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 1271US8118645B2Polishing method, polishing pad, and polishing systemWANG YU-PIAO·Filed 2009·Granted Feb 21, 2012·4 cites·33 claims
- 1370US6686278B2Method for forming a plug metal layerUNITED MICROELECTRONICS CORP·Filed 2001·Granted Feb 3, 2004·11 cites·8 claims
- 1469US8393936B2Substrate retaining ring for CMPWANG YU PIAO·Filed 2009·Granted Mar 12, 2013·3 cites·20 claims
- 1568US7148113B2Semiconductor device and fabricating method thereofPROMOS TECHNOLOGIES INC·Filed 2005·Granted Dec 12, 2006·3 cites·13 claims
- 1667US11858089B2Polishing layer and polishing methodIV TECH CO LTD·Filed 2019·Granted Jan 2, 2024·0 cites·6 claims
- 1767US6803310B2Method for forming a plug metal layerUNITED MICROELECTRONICS CORP·Filed 2003·Granted Oct 12, 2004·9 cites·10 claims
- 1866US6787461B2Method for forming a plug metal layerUNITED MICROELECTRONICS CORP·Filed 2002·Granted Sep 7, 2004·9 cites·2 claims
- 1965US2024307863A1Styrenic fluoropolymers and methods for making and using sameUNIV OF LOUISIANA LAFAYETTE·Filed 2023·Application pending·0 cites
- 2064US9272910B2Methods of nondestructively delaminating graphene from a metal substrateLOH KIAN PING·Filed 2012·Granted Mar 1, 2016·1 cites·24 claims
- 2161US11498181B2Polishing pad and manufacturing method of polishing pad and polishing methodIV TECH CO LTD·Filed 2018·Granted Nov 15, 2022·0 cites·23 claims
- 2260US6680258B1Method of forming an opening through an insulating layer of a semiconductor devicePROMOS TECHNOLOGIES INC·Filed 2002·Granted Jan 20, 2004·8 cites·20 claims
- 2359US10478940B2Manufacturing method of polishing layer, and polishing methodIV TECH CO LTD·Filed 2017·Granted Nov 19, 2019·0 cites·12 claims
- 2457US10518386B2Polishing pad and polishing methodIV TECH CO LTD·Filed 2017·Granted Dec 31, 2019·0 cites·43 claims
- 2557US6960808B2Semiconductor device having a lower parasitic capacitancePROMOS TECHNOLOGIES INC·Filed 2003·Granted Nov 1, 2005·6 cites·4 claims
- 2656US11850701B2Polishing pad, manufacturing method of polishing pad and polishing methodIV TECH CO LTD·Filed 2020·Granted Dec 26, 2023·0 cites·30 claims
- 2755US11908782B2Spacers formed on a substrate with etched micro-springsPALO ALTO RES CT INC·Filed 2021·Granted Feb 20, 2024·0 cites·17 claims
- 2855US8303378B2Polishing pad, polishing method and method of forming polishing padWANG YU-PIAO·Filed 2009·Granted Nov 6, 2012·0 cites·37 claims
- 2954US9393665B2Polishing method and polishing systemWANG YU-PIAO·Filed 2011·Granted Jul 19, 2016·1 cites·34 claims
- 3053US11541505B2Polishing pad, manufacturing method of polishing pad and polishing methodIV TECH CO LTD·Filed 2019·Granted Jan 3, 2023·0 cites·18 claims
- 3153US10364141B2Block copolymer nanostructures formed by disturbed self-assembly and uses thereofUNIV WASHINGTON STATE·Filed 2014·Granted Jul 30, 2019·0 cites·5 claims
- 3251US8303382B2Polishing pad and method of fabricationWANG YU-PIAO·Filed 2006·Granted Nov 6, 2012·0 cites·28 claims
- 3351US2016028112A1Gum-like electrolytes and methods of making the sameUNIV WASHINGTON STATE·Filed 2014·Application pending·0 cites
- 3449US8721394B2Polishing pad and polishing methodWANG YU-PIAO·Filed 2007·Granted May 13, 2014·0 cites·60 claims
- 3547US10347915B2Multi-functional binders for forming integrated electrodesUNIV WASHINGTON STATE·Filed 2015·Granted Jul 9, 2019·0 cites·20 claims
- 3645US2012152845A1Porous silica-metal organic composite adsorbents and methods of making and using the sameLEVAN M DOUGLAS·Filed 2011·Application pending·0 cites
- 3743US2014186250A1Carbonyl functionalized porous inorganic oxide adsorbents and methods of making and using the sameLEVAN M DOUGLAS·Filed 2012·Application pending·0 cites
- 3841US2016104554A1Functionalized porous polymer nanocompositesUNIV WASHINGTON STATE·Filed 2015·Application pending·0 cites
- 3936US2014190550A1Tandem solar cell with graphene interlayer and method of makingLOH KIAN PING·Filed 2012·Application pending·0 cites
- 4029US5469426AHigh write speed erasable optical recording disk using active semiconductor devices at each pixelFiled 1993·Granted Nov 21, 1995·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →