Inventor · disambiguated record
Yumiko Yamamoto
Also filed as: YAMAMOTO YUMIKO
9 granted patents·3 pending applications·20 citations·filing 2002–2024
83Inventor score
Top patents by PatentIndex Score
12 records- 0186US11521609B2Voice command system and voice command methodKYOCERA CORP·Filed 2018·Granted Dec 6, 2022·7 cites·18 claims
- 0278US9161896B2CosmeticYAMAMOTO YUMIKO·Filed 2011·Granted Oct 20, 2015·3 cites·13 claims
- 0372US8586065B2Oil-in-water emulsified cosmetic compositionYAMAMOTO YUMIKO·Filed 2010·Granted Nov 19, 2013·1 cites·17 claims
- 0468US7846969B2Ceramide emulsionsKAO CORP·Filed 2002·Granted Dec 7, 2010·3 cites·11 claims
- 0567US8178584B2Water-in oil emulsified compositionOKUBO KOJI·Filed 2004·Granted May 15, 2012·1 cites·17 claims
- 0666US12002467B2Voice command system and voice command methodKYOCERA CORP·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 0763US8929129B2Semiconductor devicePS4 LUXCO SARL·Filed 2013·Granted Jan 6, 2015·3 cites·20 claims
- 0863US7652125B2Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the sameSUMITOMO BAKELITE CO·Filed 2005·Granted Jan 26, 2010·2 cites·14 claims
- 0962US9694076B2Vesicle compositionKAO CORP·Filed 2016·Granted Jul 4, 2017·0 cites·13 claims
- 1059US2005013839A1Oil-in-water emulsified cosmetic compositionKAO CORP·Filed 2004·Application pending·0 cites
- 1158US2025019489A1Thermosetting resin composition, thermally conductive resin sheet, heat-dissipating layered product, heat-dissipating circuit board, semiconductor device and power moduleMITSUBISHI CHEM CORP·Filed 2024·Application pending·0 cites
- 1251US2014018443A1Vesicle compositionYAMAMOTO YUMIKO·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →