Inventor · disambiguated record
Zen-Jay Tsai
Also filed as: TSAI ZEN-JAY
10 granted patents·1 pending application·19 citations·filing 2010–2024
83Inventor score
Top patents by PatentIndex Score
11 records- 0187US8278166B2Method of manufacturing complementary metal oxide semiconductor deviceCHEN CHUN-CHIA·Filed 2010·Granted Oct 2, 2012·12 cites·12 claims
- 0283US12328898B2High voltage semiconductor device including buried oxide layerUNITED MICROELECTRONICS CORP·Filed 2024·Granted Jun 10, 2025·0 cites·10 claims
- 0376US12040396B2High voltage semiconductor device including buried oxide layerUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jul 16, 2024·0 cites·9 claims
- 0472US11417685B2Fin transistor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2019·Granted Aug 16, 2022·1 cites·8 claims
- 0569US11869953B2High voltage transistor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jan 9, 2024·0 cites·3 claims
- 0669US11721702B2Fabrication method of fin transistorUNITED MICROELECTRONICS CORP·Filed 2022·Granted Aug 8, 2023·0 cites·10 claims
- 0768US11626515B2High voltage semiconductor device including buried oxide layer and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Apr 11, 2023·0 cites·9 claims
- 0867US8841181B2Method for fabricating semiconductor device and PMOS device fabricated by the methodCHOU YING-HUNG·Filed 2012·Granted Sep 23, 2014·4 cites·15 claims
- 0964US11476343B2High voltage transistor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Oct 18, 2022·0 cites·8 claims
- 1058US2025301924A1Semiconductor device and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1157US8709930B2Semiconductor processTSAI ZEN-JAY·Filed 2011·Granted Apr 29, 2014·2 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →