Inventor · disambiguated record
Zhitao Chen
Also filed as: CHEN ZHITAO
8 granted patents·13 pending applications·1 citations·filing 2019–2025
71Inventor score
Files withINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES15SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD2GEORGIA TECH RES INST1GP TECH & INNOVATION LIMITED1GUANGDONG INST SEMICONDUCTOR INDUSTRIAL TECH1
Top patents by PatentIndex Score
21 records- 0176US11609672B1Touch control substrate and preparation method thereof, touch control module and display deviceINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2022·Granted Mar 21, 2023·1 cites·20 claims
- 0264US2025174669A1Host material for rechargeable zinc anodes in aqueous batteriesGEORGIA TECH RES INST·Filed 2023·Application pending·0 cites
- 0363US2024097121A1Negative electrode material and preparation method therefor, nickel-metal hydride secondary battery using the negative electrode materialGP TECH & INNOVATION LIMITED·Filed 2022·Application pending·0 cites
- 0457US12275918B2Cleaning compositions for cleaning hard surfacesSHANGHAI JAHWA UNITED CO LTD·Filed 2019·Granted Apr 15, 2025·0 cites·6 claims
- 0556US12506252B2Fan-out package structure and fabrication method thereforINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 0656US2025157971A1Three-dimensional chip stack preparing method and three-dimensional chip stacking structureINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2024·Application pending·0 cites
- 0753US2024153913A13d stacked packaging structure and manufacturing method thereofINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2024·Application pending·0 cites
- 0851US2024234328A9Multi-chip interconnection package structure with heat dissipation plate and preparation method thereofINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2023·Application pending·0 cites
- 0951US2024304556A1Chiplet-fine-interconnection-package structure and method of manufacturing the sameINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2023·Application pending·0 cites
- 1048US2024186254A1Carrier structure suitable for chiplet fine line and manufacturing method thereof, and fine line chiplet packaging structure and manufacturing method of the sameINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2023·Application pending·0 cites
- 1148US2025246533A1Fan-out package structure with inter-chip fine internal interconnection line and manufacturing method thereofINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2022·Application pending·0 cites
- 1247US12266623B2Substrate bonding methodSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 1346US12184253B2Filter radio frequency module packaging structure and method for manufacturing sameINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Granted Dec 31, 2024·0 cites·18 claims
- 1444US11869872B2Chip stack packaging structure and chip stack packaging methodINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Granted Jan 9, 2024·0 cites·19 claims
- 1544US2023245944A1Fan-out type package preparation method of fan-out type packageINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Application pending·0 cites
- 1643US12112956B2Chip interconnection package structure and methodINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Granted Oct 8, 2024·0 cites·20 claims
- 1743US2023402525A1Manufacturing method for n-polar gan transistor structure and semiconductor structureINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Application pending·0 cites
- 1842US2022375892A1Chip packaging method and chip packaging structureINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2021·Application pending·0 cites
- 1941US2025174565A1Embedded three-dimensional fan-out package structure and preparation method thereofSHENZHEN XIUYUAN ELECTRONIC TECH CO LTD·Filed 2025·Application pending·0 cites
- 2040US2022149007A1Chip packaging structure and methodINST OF SEMICONDUCTORS GUANGDONG ACADEMY OF SCIENCES·Filed 2020·Application pending·0 cites
- 2132US11784625B2Packaging method and package structure for filter chipGUANGDONG INST SEMICONDUCTOR INDUSTRIAL TECH·Filed 2019·Granted Oct 10, 2023·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →