Inventor · disambiguated record
Zhenjiang Cui
Also filed as: CUI ZHENJIANG · CUI ZHENJIANG DAVID · M'SAAD HICHEM
40 granted patents·14 pending applications·1,440 citations·filing 2001–2025
98Inventor score
Top patents by PatentIndex Score
54 records- 0198US9947549B1Cobalt-containing material removalAPPLIED MATERIALS INC·Filed 2016·Granted Apr 17, 2018·103 cites·20 claims
- 0298US9576788B2Cleaning high aspect ratio viasAPPLIED MATERIALS INC·Filed 2015·Granted Feb 21, 2017·99 cites·12 claims
- 0398US9478434B2Chlorine-based hardmask removalAPPLIED MATERIALS INC·Filed 2014·Granted Oct 25, 2016·134 cites·14 claims
- 0498US9355862B2Fluorine-based hardmask removalAPPLIED MATERIALS INC·Filed 2014·Granted May 31, 2016·147 cites·12 claims
- 0598US7018941B2Post treatment of low k dielectric filmsAPPLIED MATERIALS INC·Filed 2004·Granted Mar 28, 2006·674 cites·20 claims
- 0697US11062921B1Systems and methods for aluminum-containing film removalAPPLIED MATERIALS INC·Filed 2020·Granted Jul 13, 2021·11 cites·20 claims
- 0796US7879683B2Methods and apparatus of creating airgap in dielectric layers for the reduction of RC delayAPPLIED MATERIALS INC·Filed 2007·Granted Feb 1, 2011·35 cites·17 claims
- 0894US7811924B2Air gap formation and integration using a patterning capAPPLIED MATERIALS INC·Filed 2008·Granted Oct 12, 2010·28 cites·18 claims
- 0991US7097886B2Deposition process for high aspect ratio trenchesAPPLIED MATERIALS INC·Filed 2002·Granted Aug 29, 2006·56 cites·19 claims
- 1090US7189658B2Strengthening the interface between dielectric layers and barrier layers with an oxide layer of varying composition profileAPPLIED MATERIALS INC·Filed 2005·Granted Mar 13, 2007·11 cites·20 claims
- 1187US7259111B2Interface engineering to improve adhesion between low k stacksAPPLIED MATERIALS INC·Filed 2005·Granted Aug 21, 2007·14 cites·17 claims
- 1285US8951911B2Process for damascene structure with reduced low-k damageNAIK MEHUL B·Filed 2011·Granted Feb 10, 2015·12 cites·1 claims
- 1384US11769671B2Systems and methods for selective metal compound removalAPPLIED MATERIALS INC·Filed 2020·Granted Sep 26, 2023·1 cites·20 claims
- 1482US7547643B2Techniques promoting adhesion of porous low K film to underlying barrier layerAPPLIED MATERIALS INC·Filed 2005·Granted Jun 16, 2009·6 cites·17 claims
- 1580US11121002B2Systems and methods for etching metals and metal derivativesAPPLIED MATERIALS INC·Filed 2018·Granted Sep 14, 2021·3 cites·18 claims
- 1680US7229911B2Adhesion improvement for low k dielectrics to conductive materialsAPPLIED MATERIALS INC·Filed 2004·Granted Jun 12, 2007·24 cites·9 claims
- 1780US6936843B2Fixture used to prepare semiconductor specimens for film adhesion testingAPPLIED MATERIALS INC·Filed 2004·Granted Aug 30, 2005·21 cites·7 claims
- 1877US10854426B2Metal recess for semiconductor structuresAPPLIED MATERIALS INC·Filed 2018·Granted Dec 1, 2020·2 cites·19 claims
- 1972US12300501B2Systems and methods for selective metal compound removalAPPLIED MATERIALS INC·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 2072US7459404B2Adhesion improvement for low k dielectricsAPPLIED MATERIALS INC·Filed 2006·Granted Dec 2, 2008·2 cites·16 claims
- 2171US11328909B2Chamber conditioning and removal processesAPPLIED MATERIALS INC·Filed 2017·Granted May 10, 2022·1 cites·17 claims
- 2270US10861676B2Metal recess for semiconductor structuresAPPLIED MATERIALS INC·Filed 2018·Granted Dec 8, 2020·1 cites·19 claims
- 2368US12300503B2Etching of metal oxides using fluorine and metal halidesAPPLIED MATERIALS INC·Filed 2022·Granted May 13, 2025·0 cites·10 claims
- 2467US6635144B2Apparatus and method for detecting an end point of chamber cleaning in semiconductor equipmentAPPLIED MATERIALS INC·Filed 2001·Granted Oct 21, 2003·11 cites·8 claims
- 2566US2025183053A1Metal oxide directional removalAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2665US12272563B2Metal oxide directional removalAPPLIED MATERIALS INC·Filed 2021·Granted Apr 8, 2025·0 cites·9 claims
- 2764US7588036B2Chamber clean method using remote and in situ plasma cleaning systemsAPPLIED MATERIALS INC·Filed 2002·Granted Sep 15, 2009·7 cites·22 claims
- 2864US6890597B2HDP-CVD uniformity controlAPPLIED MATERIALS INC·Filed 2003·Granted May 10, 2005·6 cites·22 claims
- 2964US6878644B2Multistep cure technique for spin-on-glass filmsAPPLIED MATERIALS INC·Filed 2003·Granted Apr 12, 2005·9 cites·16 claims
- 3062US6818894B2Method and apparatus for characterization of ultrathin silicon oxide films using mirror-enhanced polarized reflectance fourier transform infrared spectroscopyUNIV ILLINOIS·Filed 2002·Granted Nov 16, 2004·11 cites·32 claims
- 3159US12087595B2Metal deposition and etch in high aspect-ratio featuresAPPLIED MATERIALS INC·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 3259US6992024B2Gapfill process using a combination of spin-on-glass deposition and chemical vapor deposition techniquesAPPLIED MATERIALS INC·Filed 2003·Granted Jan 31, 2006·7 cites·21 claims
- 3357US2025391666A1Residue removal after etch processes using a boron-containing etchantAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3455US11488835B2Systems and methods for tungsten-containing film removalAPPLIED MATERIALS INC·Filed 2020·Granted Nov 1, 2022·0 cites·20 claims
- 3555US2025293046A1Prime step for metal etch in high aspect-ratio featuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3654US11798813B2Selective removal of ruthenium-containing materialsAPPLIED MATERIALS INC·Filed 2021·Granted Oct 24, 2023·0 cites·17 claims
- 3754US11631589B2Metal etch in high aspect-ratio featuresAPPLIED MATERIALS INC·Filed 2021·Granted Apr 18, 2023·0 cites·18 claims
- 3853US8058183B2Restoring low dielectric constant film propertiesCUI ZHENJIANG·Filed 2009·Granted Nov 15, 2011·1 cites·13 claims
- 3952US2024258116A1Systems and methods for titanium-containing film removalAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4051US11984325B2Selective removal of transition metal nitride materialsAPPLIED MATERIALS INC·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 4151US6790707B1Method of preparing a sample of a semiconductor structure for adhesion testingAPPLIED MATERIALS INC·Filed 2003·Granted Sep 14, 2004·3 cites·18 claims
- 4251US2013230986A1Adhesion improvement for low k dielectrics to conductive materialsAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 4349US11728177B2Systems and methods for nitride-containing film removalAPPLIED MATERIALS INC·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 4449US2009011148A1Methods and apparatuses promoting adhesion of dielectric barrier film to copperAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 4549US2025299969A1Systems and methods for selective metal-containing material removalAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 4648US2023386830A1Highly conformal metal etch in high aspect ratio semiconductor featuresAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 4747US2011104891A1Methods and apparatus of creating airgap in dielectric layers for the reduction of rc delayAL-BAYATI AMIR·Filed 2011·Application pending·0 cites
- 4846US11682560B2Systems and methods for hafnium-containing film removalAPPLIED MATERIALS INC·Filed 2018·Granted Jun 20, 2023·0 cites·17 claims
- 4944US2016068969A1Integrated processing for microcontamination preventionAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 5039US9960049B2Two-step fluorine radical etch of hafnium oxideAPPLIED MATERIALS INC·Filed 2016·Granted May 1, 2018·0 cites·16 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →