Inventor · disambiguated record
Zhiwei Gong
Also filed as: GONG ZHIWEI · GONG ZHIWEI TONY
57 granted patents·13 pending applications·317 citations·filing 2008–2024
98Inventor score
Top patents by PatentIndex Score
70 records- 0197US8916421B2Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduitsGONG ZHIWEI·Filed 2011·Granted Dec 23, 2014·65 cites·17 claims
- 0295US11404288B1Semiconductor device packaging warpage controlNXP USA INC·Filed 2021·Granted Aug 2, 2022·3 cites·20 claims
- 0395US9721881B1Apparatus and methods for multi-die packagingFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Aug 1, 2017·14 cites·20 claims
- 0495US9607918B2Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereofFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Mar 28, 2017·13 cites·20 claims
- 0595US9257393B1Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereofGONG ZHIWEI·Filed 2014·Granted Feb 9, 2016·18 cites·18 claims
- 0694US9673150B2EMI/RFI shielding for semiconductor device packagesGONG ZHIWEI·Filed 2014·Granted Jun 6, 2017·18 cites·18 claims
- 0794US8216918B2Method of forming a packaged semiconductor deviceGONG ZHIWEI·Filed 2010·Granted Jul 10, 2012·22 cites·5 claims
- 0893US11791283B2Semiconductor device packaging warpage controlNXP USA INC·Filed 2021·Granted Oct 17, 2023·2 cites·16 claims
- 0992US11557525B2Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elementsNXP USA INC·Filed 2021·Granted Jan 17, 2023·3 cites·11 claims
- 1091US8617935B2Back side alignment structure and manufacturing method for three-dimensional semiconductor device packagesXU JIANWEN·Filed 2011·Granted Dec 31, 2013·14 cites·20 claims
- 1190US10074614B2EMI/RFI shielding for semiconductor device packagesNXP USA INC·Filed 2017·Granted Sep 11, 2018·6 cites·19 claims
- 1290US8329509B2Packaging process to create wettable lead flank during board assemblyGONG ZHIWEI·Filed 2010·Granted Dec 11, 2012·21 cites·20 claims
- 1389US9331029B2Microelectronic packages having mold-embedded traces and methods for the production thereofVINCENT MICHAEL B·Filed 2014·Granted May 3, 2016·11 cites·20 claims
- 1489US9281284B2System-in-packages having vertically-interconnected leaded components and methods for the fabrication thereofYAP WENG F·Filed 2014·Granted Mar 8, 2016·11 cites·19 claims
- 1588US11031681B2Package integrated waveguideNXP USA INC·Filed 2019·Granted Jun 8, 2021·6 cites·20 claims
- 1688US8597983B2Semiconductor device packaging having substrate with pre-encapsulation through via formationGONG ZHIWEI·Filed 2011·Granted Dec 3, 2013·10 cites·13 claims
- 1787US9093457B2Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereofGONG ZHIWEI·Filed 2012·Granted Jul 28, 2015·10 cites·13 claims
- 1886US9362211B1Exposed pad integrated circuit package with mold lockFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 7, 2016·7 cites·19 claims
- 1986US9142502B2Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduitsGONG ZHIWEI·Filed 2011·Granted Sep 22, 2015·9 cites·13 claims
- 2085US12040291B2Radio frequency packages containing multilevel power substrates and associated fabrication methodsNXP USA INC·Filed 2021·Granted Jul 16, 2024·1 cites·20 claims
- 2184US9036363B2Devices and stacked microelectronic packages with parallel conductors and intra-conductor isolator structures and methods of their fabricationVINCENT MICHAEL B·Filed 2013·Granted May 19, 2015·7 cites·17 claims
- 2283US9899298B2Microelectronic packages having mold-embedded traces and methods for the production thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Feb 20, 2018·1 cites·20 claims
- 2382US12184237B2Surface-mount amplifier devicesNXP USA INC·Filed 2021·Granted Dec 31, 2024·1 cites·20 claims
- 2481US10083912B2Method of packaging integrated circuit die and deviceFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Sep 25, 2018·4 cites·17 claims
- 2581US9190390B2Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereofGONG ZHIWEI TONY·Filed 2012·Granted Nov 17, 2015·8 cites·20 claims
- 2678US11222790B2Tie bar removal for semiconductor device packagingNXP USA INC·Filed 2020·Granted Jan 11, 2022·1 cites·16 claims
- 2776US2025006511A1Semiconductor device packaging warpage controlNXP USA INC·Filed 2024·Application pending·0 cites
- 2875US9799636B2Packaged devices with multiple planes of embedded electronic devicesFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Oct 24, 2017·2 cites·7 claims
- 2975US9502363B2Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layersVINCENT MICHAEL B·Filed 2014·Granted Nov 22, 2016·4 cites·16 claims
- 3074US9142434B2Method for singulating electronic components from a substrateGAO WEI·Filed 2008·Granted Sep 22, 2015·4 cites·7 claims
- 3172US9548280B2Solder pad for semiconductor device packageFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jan 17, 2017·3 cites·15 claims
- 3272US8980696B2Method of packaging semiconductor dieMENG DOMINIC KOEY POH·Filed 2011·Granted Mar 17, 2015·6 cites·16 claims
- 3371US10834817B2Plated opening with vent pathNXP USA INC·Filed 2018·Granted Nov 10, 2020·1 cites·9 claims
- 3471US2023369248A1Semiconductor device packaging warpage controlNXP USA INC·Filed 2023·Application pending·0 cites
- 3570US11935809B2Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elementsNXP USA INC·Filed 2022·Granted Mar 19, 2024·0 cites·20 claims
- 3669US11335652B2Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguideNXP USA INC·Filed 2019·Granted May 17, 2022·1 cites·20 claims
- 3769US10068841B2Apparatus and methods for multi-die packagingNXP USA INC·Filed 2017·Granted Sep 4, 2018·1 cites·20 claims
- 3868US11967507B2Tie bar removal for semiconductor device packagingNXP USA INC·Filed 2021·Granted Apr 23, 2024·0 cites·20 claims
- 3968US10143084B2Plated opening with vent pathNXP USA INC·Filed 2016·Granted Nov 27, 2018·1 cites·14 claims
- 4067US9520323B2Microelectronic packages having trench vias and methods for the manufacture thereofVINCENT MICHAEL B·Filed 2012·Granted Dec 13, 2016·2 cites·18 claims
- 4166US8735223B2Semiconductor devices and methods of assembling sameGAO WEI·Filed 2012·Granted May 27, 2014·2 cites·15 claims
- 4265US12125716B2Semiconductor device packaging warpage controlNXP USA INC·Filed 2021·Granted Oct 22, 2024·0 cites·16 claims
- 4364US9257415B2Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereofVINCENT MICHAEL B·Filed 2015·Granted Feb 9, 2016·1 cites·20 claims
- 4463US9570387B1Three-dimensional integrated circuit systems in a package and methods thereforFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Feb 14, 2017·1 cites·12 claims
- 4562US11728285B2Semiconductor device packaging warpage controlNXP USA INC·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 4661US2024347928A1Antenna packageNXP BV·Filed 2024·Application pending·0 cites
- 4761US2025323154A1Semiconductor device with embedded flex substrate and method thereforNXP USA INC·Filed 2024·Application pending·0 cites
- 4859US12387985B2Semiconductor device with cavity carrier and method thereforNXP BV·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 4959US2025079381A1Double-sided multichip packages with direct die-to-die couplingNXP USA INC·Filed 2023·Application pending·0 cites
- 5057US9000589B2Semiconductor device with redistributed contactsKOEY DOMINIC POH MENG·Filed 2012·Granted Apr 7, 2015·2 cites·6 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →