Inventor · disambiguated record
Zheng Ju
Also filed as: JU ZHENG
5 granted patents·12 pending applications·0 citations·filing 2021–2025
61Inventor score
Files withAPPLIED MATERIALS INC11UNIV ARIZONA STATE3SHENZHEN YUEJIANG TECH CO LTD2HUAWEI TECH CO LTD1
Top patents by PatentIndex Score
17 records- 0181US2025380533A1Contacts of solar cells and other optoelectronic devicesUNIV ARIZONA STATE·Filed 2025·Application pending·0 cites
- 0271US12408474B2Contacts of solar cells and other optoelectronic devicesUNIV ARIZONA STATE·Filed 2023·Granted Sep 2, 2025·0 cites·19 claims
- 0363US12050101B2Sensing circuit, logic circuit board, joint control board, main controller board, and robotSHENZHEN YUEJIANG TECH CO LTD·Filed 2021·Granted Jul 30, 2024·0 cites·21 claims
- 0462US12123713B2Housing, housing assembly, mechanical arm, and robot of mechanical equipmentSHENZHEN YUEJIANG TECH CO LTD·Filed 2021·Granted Oct 22, 2024·0 cites·20 claims
- 0560US2025374685A1Hole contact for electronic and optoelectronic devicesUNIV ARIZONA STATE·Filed 2025·Application pending·0 cites
- 0659US2025157856A1Low-temperature molybdenum capping processesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0758US2025218867A1Selective deposition of capping layerAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0857US2024332075A1Gradient metal liner for interconnect structuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0956US11952655B2Electromagnet pulsing effect on PVD step coverageAPPLIED MATERIALS INC·Filed 2022·Granted Apr 9, 2024·0 cites·5 claims
- 1056US2024420966A1Copper reflow by surface modificationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1156US2024258103A1Plasma treatment of barrier and liner layersAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1255US2024420996A1Selective self-assembled monolayer (sam) removalAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1354US2024420997A1Selective liner deposition for via resistance reductionAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1453US2024321633A1Ultra-thin layers by selective passivationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1553US2024290655A1Selective via-fill with conformal sidewall coverageAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1652US2024006235A1Composite barrier layersAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1744US12342143B2Method and system for switching sound channel of headset, and headset terminalHUAWEI TECH CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →