Inventor · disambiguated record
Zhihong Mai
Also filed as: MAI ZHIHONG
10 granted patents·27 citations·filing 2000–2018
83Inventor score
Files withGLOBALFOUNDRIES SG PTE LTD5ADVANCED MICRO DEVICES INC2MAI ZHIHONG2ADVANCED MICRO DEVICES PTE LTD1
Top patents by PatentIndex Score
10 records- 0170US10497820B1Wedge-shaped fiber array on a silicon-photonic device and method for producing the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2018·Granted Dec 3, 2019·1 cites·16 claims
- 0266US9964589B1System for detection of a photon emission generated by a device and methods for detecting the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2016·Granted May 8, 2018·1 cites·19 claims
- 0362US9496187B2Setup for multiple cross-section sample preparationGLOBALFOUNDRIES SG PTE LTD·Filed 2013·Granted Nov 15, 2016·2 cites·20 claims
- 0461US6917011B2Method and apparatus for decapping integrated circuit packagesADVANCED MICRO DEVICES PTE LTD·Filed 2002·Granted Jul 12, 2005·18 cites·18 claims
- 0560US8489945B2Method and system for introducing physical damage into an integrated circuit device for verifying testing program and its resultsMAI ZHIHONG·Filed 2010·Granted Jul 16, 2013·2 cites·20 claims
- 0647US10656362B2Gamma groove arrays for interconnecting and mounting devicesGLOBALFOUNDRIES SG PTE LTD·Filed 2018·Granted May 19, 2020·0 cites·9 claims
- 0744US9128117B2Laser-enhanced chemical etching of nanotipsGLOBALFOUNDRIES SG PTE LTD·Filed 2013·Granted Sep 8, 2015·0 cites·20 claims
- 0841US8158513B2Integrated circuit system employing backside energy source for electrical contact formationMAI ZHIHONG·Filed 2008·Granted Apr 17, 2012·0 cites·20 claims
- 0940US6821796B1Method and system for temperature cycling at an interface between an IC die and an underfill materialADVANCED MICRO DEVICES INC·Filed 2002·Granted Nov 23, 2004·0 cites·18 claims
- 1038US6531865B1Method of and apparatus for testing an integrated circuit packageADVANCED MICRO DEVICES INC·Filed 2000·Granted Mar 11, 2003·3 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →