Inventor · disambiguated record
Zhiqiang Niu
Also filed as: NIU ZHIQIANG
37 granted patents·11 pending applications·57 citations·filing 2010–2025
95Inventor score
Files withALPHA & OMEGA SEMICONDUCTOR INT LP15ALPHA & OMEGA SEMICONDUCTOR13ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD11ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD2BEIJING JINGDONG ZHENSHI INFORMATION TECH CO LTD1
Top patents by PatentIndex Score
48 records- 0191US9704789B1Molded intelligent power moduleALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD·Filed 2016·Granted Jul 11, 2017·11 cites·15 claims
- 0289US9754864B1Semiconductor power device having single in-line lead module and method of making the sameALPHA & OMEGA SEMICONDUCTOR·Filed 2016·Granted Sep 5, 2017·6 cites·10 claims
- 0388US11101137B1Method of making reverse conducting insulated gate bipolar transistorALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2020·Granted Aug 24, 2021·2 cites·15 claims
- 0487US9054091B2Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structuresYILMAZ HAMZA·Filed 2013·Granted Jun 9, 2015·6 cites·18 claims
- 0585US11417648B2Intelligent power module containing IGBT and super-junction MOSFETALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2020·Granted Aug 16, 2022·2 cites·20 claims
- 0684US9269699B2Embedded package and method thereofALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Feb 23, 2016·6 cites·18 claims
- 0783US9881856B1Molded intelligent power moduleALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD·Filed 2017·Granted Jan 30, 2018·4 cites·15 claims
- 0881US8987878B2Substrateless power device packagesFENG TAO·Filed 2010·Granted Mar 24, 2015·5 cites·7 claims
- 0978US10600727B2Molded intelligent power module for motorsALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2018·Granted Mar 24, 2020·4 cites·20 claims
- 1076US10141249B2Molded intelligent power module and method of making the sameALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2017·Granted Nov 27, 2018·2 cites·12 claims
- 1172US9318424B2MCSP power semiconductor devices and preparation methods thereofALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Apr 19, 2016·2 cites·13 claims
- 1269US10438900B1HV converter with reduced EMIALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2018·Granted Oct 8, 2019·1 cites·23 claims
- 1367US10177080B2Molded intelligent power moduleALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2017·Granted Jan 8, 2019·1 cites·16 claims
- 1466US12015336B2Power converter for high power density applicationsALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2023·Granted Jun 18, 2024·0 cites·10 claims
- 1566US9564406B1Battery protection package and process of making the sameALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted Feb 7, 2017·1 cites·11 claims
- 1666US2025183123A1Power module having interconnected base plate with molded metal and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2025·Application pending·0 cites
- 1765US9136154B2Substrateless power device packagesALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Sep 15, 2015·1 cites·7 claims
- 1864US12438069B2Semiconductor power module package having lead frame anchored barsALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2022·Granted Oct 7, 2025·0 cites·11 claims
- 1958USD1042375SPower semiconductor moduleALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2022·Granted Sep 17, 2024·2 cites·1 claims
- 2058US11750089B2Power converter for high power densityALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2021·Granted Sep 5, 2023·0 cites·16 claims
- 2156US2021175155A1Power module having interconnected base plate with molded metal and method of making the sameALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2019·Application pending·0 cites
- 2256US2025118638A1Apparatus having surface mount packages having co-packed field effect transistorsALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2023·Application pending·0 cites
- 2356US2025112132A1Semiconductor package having lead frame with slanted sectionsALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2023·Application pending·0 cites
- 2456US2024429140A1Semiconductor package having multiple redistribution layers and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2023·Application pending·0 cites
- 2555US10043736B2Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structuresALPHA & OMEGA SEMICONDUCTOR·Filed 2016·Granted Aug 7, 2018·0 cites·18 claims
- 2654US10396019B2Molded intelligent power module and method of making the sameALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2018·Granted Aug 27, 2019·0 cites·6 claims
- 2753US10763221B2HV converter with reduced EMIALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2019·Granted Sep 1, 2020·0 cites·23 claims
- 2853US9425181B2Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structuresALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted Aug 23, 2016·0 cites·16 claims
- 2952US12249562B2Intelligent power module containing exposed surfaces of transistor die supporting elementsALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2022·Granted Mar 11, 2025·0 cites·20 claims
- 3052US11699627B2DMOS FET chip scale package and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2021·Granted Jul 11, 2023·0 cites·17 claims
- 3150US11222858B1Semiconductor package having enlarged gate pad and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2020·Granted Jan 11, 2022·0 cites·20 claims
- 3250US9768146B2Battery protection package and process of making the sameALPHA & OMEGA SEMICONDUCTOR·Filed 2016·Granted Sep 19, 2017·0 cites·9 claims
- 3349USD1037187SPower semiconductor moduleALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2022·Granted Jul 30, 2024·1 cites·1 claims
- 3449US9966328B2Semiconductor power device having single in-line lead module and method of making the sameALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2017·Granted May 8, 2018·0 cites·9 claims
- 3547US9685430B2Embedded package and method thereofALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted Jun 20, 2017·0 cites·4 claims
- 3647US2015340301A1Substrateless power device packagesALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Application pending·0 cites
- 3747US2024403815A1Distribution route determination method and apparatus, and electronic device and readable storage mediumBEIJING JINGDONG ZHENSHI INFORMATION TECH CO LTD·Filed 2022·Application pending·0 cites
- 3844US2013314844A1Method of preparing reduced graphene oxide foamUNIV NANYANG TECH·Filed 2013·Application pending·0 cites
- 3942US11069604B2Semiconductor package and method of making the sameALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2018·Granted Jul 20, 2021·0 cites·14 claims
- 4042US10056893B2Molded power module having single in-line leadsALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2016·Granted Aug 21, 2018·0 cites·20 claims
- 4141US2014175628A1Copper wire bonding structure in semiconductor device and fabrication method thereofPAN HUA·Filed 2012·Application pending·0 cites
- 4241US2020269323A1Synthesis of ultra-thin metal nanowires using organic free radicalsUNIV CALIFORNIA·Filed 2017·Application pending·0 cites
- 4341US2020194347A1Semiconductor package and method of making the sameALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2018·Application pending·0 cites
- 4438US9245861B2Wafer process for molded chip scale package (MCSP) with thick backside metallizationALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Jan 26, 2016·0 cites·13 claims
- 4536USD1107671SPower semiconductor moduleALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2024·Granted Dec 30, 2025·0 cites·1 claims
- 4635US9837386B2Power device and preparation method thereofALPHA & OMEGA SEMICONDUCTOR·Filed 2016·Granted Dec 5, 2017·0 cites·19 claims
- 4733US9520380B2Wafer process for molded chip scale package (MCSP) with thick backside metallizationALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted Dec 13, 2016·0 cites·13 claims
- 4833US8703545B2Aluminum alloy lead-frame and its use in fabrication of power semiconductor packageNIU ZHIQIANG·Filed 2012·Granted Apr 22, 2014·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →