Inventor · disambiguated record
Zhuowen Sun
Also filed as: SUN ZHUOWEN
45 granted patents·5 pending applications·274 citations·filing 2011–2025
98Inventor score
Top patents by PatentIndex Score
50 records- 0198US10115678B2Wire bond wires for interference shieldingINVENSAS CORP·Filed 2017·Granted Oct 30, 2018·26 cites·20 claims
- 0298US9812402B2Wire bond wires for interference shieldingINVENSAS CORP·Filed 2016·Granted Nov 7, 2017·30 cites·20 claims
- 0398US9397038B1Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substratesINVENSAS CORP·Filed 2015·Granted Jul 19, 2016·27 cites·25 claims
- 0497US11810867B2Wire bond wires for interference shieldingINVENSAS LLC·Filed 2022·Granted Nov 7, 2023·2 cites·28 claims
- 0597US9490222B1Wire bond wires for interference shieldingINVENSAS CORP·Filed 2015·Granted Nov 8, 2016·20 cites·20 claims
- 0696US10559537B2Wire bond wires for interference shieldingINVENSAS CORP·Filed 2018·Granted Feb 11, 2020·10 cites·18 claims
- 0796US9984992B2Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfacesINVENSAS CORP·Filed 2016·Granted May 29, 2018·27 cites·22 claims
- 0896US9349707B1Contact arrangements for stackable microelectronic package structures with multiple ranksINVENSAS CORP·Filed 2015·Granted May 24, 2016·29 cites·20 claims
- 0994US9972609B2Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods thereforINVENSAS CORP·Filed 2016·Granted May 15, 2018·8 cites·9 claims
- 1093US10354976B2Dies-on-package devices and methods thereforINVENSAS CORP·Filed 2016·Granted Jul 16, 2019·6 cites·16 claims
- 1191US10325877B2Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfacesINVENSAS CORP·Filed 2018·Granted Jun 18, 2019·7 cites·20 claims
- 1291US9991235B2Package on-package devices with upper RDL of WLPS and methods thereforINVENSAS CORP·Filed 2016·Granted Jun 5, 2018·5 cites·9 claims
- 1391US9991233B2Package-on-package devices with same level WLP components and methods thereforINVENSAS CORP·Filed 2016·Granted Jun 5, 2018·5 cites·19 claims
- 1491US9484080B1High-bandwidth memory application with controlled impedance loadingINVENSAS CORP·Filed 2015·Granted Nov 1, 2016·8 cites·24 claims
- 1591US9402312B2Circuit assemblies with multiple interposer substrates, and methods of fabricationINVENSAS CORP·Filed 2014·Granted Jul 26, 2016·11 cites·16 claims
- 1690US11462483B2Wire bond wires for interference shieldingINVENSAS LLC·Filed 2019·Granted Oct 4, 2022·3 cites·24 claims
- 1790US9640282B1Flexible I/O partition of multi-die memory solutionINVENSAS CORP·Filed 2015·Granted May 2, 2017·8 cites·20 claims
- 1889US9728524B1Enhanced density assembly having microelectronic packages mounted at substantial angle to boardINVENSAS CORP·Filed 2016·Granted Aug 8, 2017·7 cites·19 claims
- 1988US10032715B2Ultra high performance interposerINVENSAS CORP·Filed 2017·Granted Jul 24, 2018·4 cites·10 claims
- 2087US9985007B2Package on-package devices with multiple levels and methods thereforINVENSAS CORP·Filed 2016·Granted May 29, 2018·3 cites·29 claims
- 2187US9972573B2Wafer-level packaged components and methods thereforINVENSAS CORP·Filed 2016·Granted May 15, 2018·3 cites·20 claims
- 2286US12255153B2Wire bond wires for interference shieldingADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Mar 18, 2025·0 cites·25 claims
- 2385US9666521B2Ultra high performance interposerINVENSAS CORP·Filed 2013·Granted May 30, 2017·5 cites·19 claims
- 2482US2025253264A1Wire bond wires for interference shieldingADEIA SEMICONDUCTOR TECH LLC·Filed 2025·Application pending·0 cites
- 2579US9640236B2Reduced load memory module using wire bonds and a plurality of rank signalsINVENSAS CORP·Filed 2015·Granted May 2, 2017·3 cites·17 claims
- 2678US9595511B1Microelectronic packages and assemblies with improved flyby signaling operationINVENSAS CORP·Filed 2016·Granted Mar 14, 2017·3 cites·23 claims
- 2777US9928883B2TFD I/O partition for high-speed, high-density applicationsINVENSAS CORP·Filed 2017·Granted Mar 27, 2018·2 cites·10 claims
- 2877US9337170B1Contact arrangements for stackable microelectronic package structuresINVENSAS CORP·Filed 2015·Granted May 10, 2016·3 cites·20 claims
- 2975US9583417B2Via structure for signal equalizationINVENSAS CORP·Filed 2014·Granted Feb 28, 2017·3 cites·14 claims
- 3072US8358193B2Planar inductor devicesTYCO ELECTRONICS CORP·Filed 2011·Granted Jan 22, 2013·3 cites·20 claims
- 3171US9691702B2Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substratesINVENSAS CORP·Filed 2016·Granted Jun 27, 2017·1 cites·20 claims
- 3267US9679613B1TFD I/O partition for high-speed, high-density applicationsINVENSAS CORP·Filed 2016·Granted Jun 13, 2017·1 cites·9 claims
- 3362US10700002B2Ultra high performance interposerINVENSAS CORP·Filed 2019·Granted Jun 30, 2020·0 cites·20 claims
- 3462US10522457B2Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substratesINVENSAS CORP·Filed 2019·Granted Dec 31, 2019·0 cites·19 claims
- 3560US10332833B2Ultra high performance interposerINVENSAS CORP·Filed 2018·Granted Jun 25, 2019·0 cites·20 claims
- 3660US10177086B2Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substratesINVENSAS CORP·Filed 2018·Granted Jan 8, 2019·0 cites·16 claims
- 3760US9281296B2Die stacking techniques in BGA memory package for small footprint CPU and memory motherboard designINVENSAS CORP·Filed 2014·Granted Mar 8, 2016·1 cites·23 claims
- 3858US9947618B2Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substratesINVENSAS CORP·Filed 2017·Granted Apr 17, 2018·0 cites·20 claims
- 3952US10103093B2Via structure for signal equalizationINVENSAS CORP·Filed 2017·Granted Oct 16, 2018·0 cites·20 claims
- 4052US9070423B2Single package dual channel memory with co-supportINVENSAS CORP·Filed 2013·Granted Jun 30, 2015·0 cites·41 claims
- 4151US10026467B2High-bandwidth memory application with controlled impedance loadingINVENSAS CORP·Filed 2016·Granted Jul 17, 2018·0 cites·19 claims
- 4249US10007622B2Method for reduced load memory moduleINVENSAS CORP·Filed 2017·Granted Jun 26, 2018·0 cites·20 claims
- 4349US9905507B2Circuit assemblies with multiple interposer substrates, and methods of fabricationINVENSAS CORP·Filed 2016·Granted Feb 27, 2018·0 cites·21 claims
- 4448US2016154542A1Electronic device for event alert and notificationSHEN HONG·Filed 2014·Application pending·0 cites
- 4546US9691437B2Compact microelectronic assembly having reduced spacing between controller and memory packagesINVENSAS CORP·Filed 2014·Granted Jun 27, 2017·0 cites·21 claims
- 4646US9460758B2Single package dual channel memory with co-supportINVENSAS CORP·Filed 2015·Granted Oct 4, 2016·0 cites·20 claims
- 4746US9343398B2BGA ballout partition techniques for simplified layout in motherboard with multiple power supply railINVENSAS CORP·Filed 2014·Granted May 17, 2016·0 cites·22 claims
- 4838US2018040587A1Vertical Memory Module Enabled by Fan-Out Redistribution LayerINVENSAS CORP·Filed 2017·Application pending·0 cites
- 4936US2018040589A1Microelectronic packages and assemblies with repeatersINVENSAS CORP·Filed 2016·Application pending·0 cites
- 5033US2017186474A1Dual-channel dimmINVENSAS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →