Inventor · disambiguated record
Zhongkui Tan
Also filed as: TAN ZHONGKUI
25 granted patents·6 pending applications·235 citations·filing 2015–2025
94Inventor score
Files withLAM RES CORP31
Top patents by PatentIndex Score
31 records- 0198US9761459B2Systems and methods for reverse pulsingLAM RES CORP·Filed 2015·Granted Sep 12, 2017·93 cites·17 claims
- 0298US9583357B1Systems and methods for reverse pulsingLAM RES CORP·Filed 2016·Granted Feb 28, 2017·98 cites·18 claims
- 0395US9991128B2Atomic layer etching in continuous plasmaLAM RES CORP·Filed 2017·Granted Jun 5, 2018·26 cites·19 claims
- 0488US9824896B2Methods and systems for advanced ion control for etching processesLAM RES CORP·Filed 2015·Granted Nov 21, 2017·4 cites·23 claims
- 0586US10658194B2Silicon-based deposition for semiconductor processingLAM RES CORP·Filed 2016·Granted May 19, 2020·2 cites·13 claims
- 0685US12437966B2Systems and methods for reverse pulsingLAM RES CORP·Filed 2023·Granted Oct 7, 2025·0 cites·7 claims
- 0782US10943789B2Methods and systems for advanced ion control for etching processesLAM RES CORP·Filed 2017·Granted Mar 9, 2021·2 cites·16 claims
- 0878US9633867B2Method and apparatus for anisotropic tungsten etchingLAM RES CORP·Filed 2015·Granted Apr 25, 2017·3 cites·19 claims
- 0976US9767991B2Methods and systems for independent control of radical density, ion density, and ion energy in pulsed plasma semiconductor device fabricationLAM RES CORP·Filed 2015·Granted Sep 19, 2017·2 cites·18 claims
- 1075US10354888B2Method and apparatus for anisotropic tungsten etchingLAM RES CORP·Filed 2017·Granted Jul 16, 2019·2 cites·13 claims
- 1175US10242845B2Near-substrate supplemental plasma density generation with low bias voltage within inductively coupled plasma processing chamberLAM RES CORP·Filed 2017·Granted Mar 26, 2019·2 cites·15 claims
- 1273US12165872B2Methods and systems for advanced ion control for etching processesLAM RES CORP·Filed 2021·Granted Dec 10, 2024·0 cites·20 claims
- 1366US9852924B1Line edge roughness improvement with sidewall sputteringLAM RES CORP·Filed 2016·Granted Dec 26, 2017·1 cites·18 claims
- 1461US2025149330A1Method for etching features using a targeted deposition for selective passivationLAM RES CORP·Filed 2025·Application pending·0 cites
- 1560US11798785B2Systems for reverse pulsingLAM RES CORP·Filed 2017·Granted Oct 24, 2023·0 cites·17 claims
- 1659US12217955B2Method for etching features using a targeted deposition for selective passivationLAM RES CORP·Filed 2020·Granted Feb 4, 2025·0 cites·20 claims
- 1759US11049726B2Methods and systems for advanced ion control for etching processesLAM RES CORP·Filed 2017·Granted Jun 29, 2021·0 cites·23 claims
- 1855US2025391658A1Integrated high aspect ratio etchingLAM RES CORP·Filed 2023·Application pending·0 cites
- 1951US2024379375A1Method and apparatus for etching a carbon containing layerLAM RES CORP·Filed 2022·Application pending·0 cites
- 2050US10177003B2Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power levelLAM RES CORP·Filed 2017·Granted Jan 8, 2019·0 cites·20 claims
- 2149US2018005803A1Methods and Systems for Independent Control of Radical Density, Ion Density, and Ion Energy in Pulsed Plasma Semiconductor Device FabricationLAM RES CORP·Filed 2017·Application pending·0 cites
- 2248US11742212B2Directional deposition in etch chamberLAM RES CORP·Filed 2019·Granted Aug 29, 2023·0 cites·14 claims
- 2347US9691625B2Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power levelLAM RES CORP·Filed 2015·Granted Jun 27, 2017·0 cites·20 claims
- 2446US9997366B2Silicon oxide silicon nitride stack ion-assisted etchLAM RES CORP·Filed 2017·Granted Jun 12, 2018·0 cites·16 claims
- 2546US2025226233A1In situ declogging in plasma etchingLAM RES CORP·Filed 2021·Application pending·0 cites
- 2645US12165878B2Semiconductor mask reshaping using a sacrificial layerLAM RES CORP·Filed 2020·Granted Dec 10, 2024·0 cites·19 claims
- 2745US9859127B1Line edge roughness improvement with photon-assisted plasma processLAM RES CORP·Filed 2016·Granted Jan 2, 2018·0 cites·11 claims
- 2843US11646207B2Silicon oxide silicon nitride stack stair step etchLAM RES CORP·Filed 2018·Granted May 9, 2023·0 cites·19 claims
- 2938US10020183B1Edge roughness reductionLAM RES CORP·Filed 2017·Granted Jul 10, 2018·0 cites·14 claims
- 3036US11037784B2Amorphous carbon layer opening processLAM RES CORP·Filed 2019·Granted Jun 15, 2021·0 cites·17 claims
- 3133US2019341275A1Edge ring focused deposition during a cleaning process of a processing chamberLAM RES CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →