Inventor · disambiguated record
Zhi Wang
Also filed as: WANG ZHI · Wang zhi-qi
2 granted patents·1 pending application·2 citations·filing 2014–2023
38Inventor score
Top patents by PatentIndex Score
3 records- 0167US9305961B2Wafer-level packaging method of BSI image sensors having different cutting processesCHINA WAFER LEVEL CSP CO LTD·Filed 2014·Granted Apr 5, 2016·2 cites·4 claims
- 0259US2025060321A1Optical inspection of wafers in manufacturing systemsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0344US9455298B2Wafer-level packaging method of BSI image sensors having different cutting processesCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Granted Sep 27, 2016·0 cites·7 claims
Join the waitlist — get patent alerts
Get an alert when Zhi Wang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →