Inventor · disambiguated record
Zheng-Wei Wu
Also filed as: WU ZHENG · Wu zheng wei
5 granted patents·4 pending applications·1 citations·filing 2008–2024
63Inventor score
Top patents by PatentIndex Score
9 records- 0172US12300630B2Semiconductor device package structure comprising package unit including adhesive layerADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted May 13, 2025·0 cites·19 claims
- 0262US11682631B2Manufacturing process steps of a semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jun 20, 2023·0 cites·15 claims
- 0355US2024404831A1Electronic device and manufacturing method thereofINNOLUX CORP·Filed 2024·Application pending·0 cites
- 0455US2011045566A1method for preparing the decellularized matrixWANG ZHICHONG·Filed 2008·Application pending·0 cites
- 0554US9372950B2Circuit layout method and circuit layout apparatusWISTRON CORP·Filed 2014·Granted Jun 21, 2016·1 cites·14 claims
- 0651US2024203897A1Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 0751US2024203896A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 0850US9271404B2Circuit board and manufacturing method thereofWISTRON CORP·Filed 2013·Granted Feb 23, 2016·0 cites·32 claims
- 0945US9549466B2Circuit board and manufacturing method thereofWISTRON CORP·Filed 2015·Granted Jan 17, 2017·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →