Circuit board and manufacturing method thereof

Abstract

A circuit board includes a circuit board plate, a conductive ring, a solder mask and at least one insulating pad. The circuit board plate includes a surface and a conductive through hole passing through the surface and the circuit board plate, wherein the conductive through hole have a conductive layer disposed on a wall thereof. The conductive ring on the surface surrounds an opening of the conductive through hole on the surface and electrically connects to the conductive layer. The solder mask is disposed on the surface. The conductive ring is exposed outside of the solder mask. The insulating pad has a thickness. The first surface of the insulating pad is adapted to contact the solder mask or the surface and sited at periphery of the conductive ring. The second surface of the insulating pad is adapted for spacing a distance between a solder coating tool and the solder mask.

What is claimed is:  
     
       1. A circuit board, comprising:
 a circuit board plate comprising a surface and a conductive through hole passing through the surface and the circuit board plate, wherein the conductive through hole have a conductive layer disposed on a wall thereof; 
 a conductive ring disposed on the surface, wherein the conductive ring surrounds an opening of the conductive through hole located on the surface and electrically connects to the conductive layer; 
 a solder mask disposed on the surface, wherein the conductive ring is exposed outside of the solder mask; and 
 at least one insulating pad comprising a first surface and a second surface opposite to each other and having a thickness, wherein the first surface is adapted to contact the solder mask or the surface of the circuit board plate and sited at periphery of the conductive ring, the second surface is adapted to contact a solder coating tool when the solder coating tool is covered on the circuit board thereby spacing a distance between the solder coating tool and the solder mask, wherein the at least one insulating pad is a non-closed ring, and the conductive ring is located within the non-closed ring. 
 
     
     
       2. The circuit board of  claim 1 , wherein the at least one of the insulating pad independently surrounds a corresponding one of the conductive ring. 
     
     
       3. The circuit board of  claim 1 , wherein the at least one of the insulating pad surrounds a corresponding plurality of the conductive rings. 
     
     
       4. The circuit board of  claim 1 , wherein the at least one insulating pad comprises a plurality of insulating pads, the plurality of insulating pads are distributed at periphery of the conductive ring. 
     
     
       5. The circuit board of  claim 4 , wherein the conductive ring is jointly surrounded by the plurality of insulating pads. 
     
     
       6. The circuit board of  claim 4 , wherein the plurality of insulating pads jointly surrounds a corresponding plurality of the conductive rings. 
     
     
       7. The circuit board of  claim 1 , wherein a material of the insulating pad comprises a silkscreen. 
     
     
       8. The circuit board of  claim 7 , wherein a color of the silkscreen is different from a color of the solder mask. 
     
     
       9. The circuit board of  claim 1 , wherein a distance between each of the at least one insulating pad and a center of the conductive through hole is greater than a radius of the conductive ring. 
     
     
       10. A circuit board, comprising:
 a circuit board plate comprising a surface and a conductive through hole passing through the surface and the circuit board plate, wherein the conductive through hole have a conductive layer disposed on a wall thereof; 
 a conductive ring disposed on the surface, wherein the conductive ring surrounds an opening of the conductive through hole located on the surface and electrically connects to the conductive layer; 
 a solder mask disposed on the surface, wherein the conductive ring is exposed outside of the solder mask; and 
 at least one insulating pad comprising a first surface and a second surface opposite to each other and having a thickness, wherein the first surface is adapted to contact the solder mask or the surface of the circuit board plate and sited at periphery of the conductive ring, the second surface is adapted to contact a solder coating tool when the solder coating tool is covered on the circuit board thereby spacing a distance between the solder coating tool and the solder mask, wherein the at least one insulating pad comprises a plurality of insulating pads, and the plurality of insulating pads are distributed at periphery of the conductive ring. 
 
     
     
       11. The circuit board of  claim 10 , wherein the conductive ring is jointly surrounded by the plurality of insulating pads. 
     
     
       12. The circuit board of  claim 10 , wherein the plurality of insulating pads jointly surrounds a corresponding plurality of the conductive rings. 
     
     
       13. The circuit board of  claim 10 , wherein a material of the insulating pad comprises a silkscreen. 
     
     
       14. The circuit board of  claim 13 , wherein a color of the silkscreen is different from a color of the solder mask. 
     
     
       15. The circuit board of  claim 10 , wherein a distance between each of the at least one insulating pad and a center of the conductive through hole is greater than a radius of the conductive ring. 
     
     
       16. A manufacturing method of a circuit board, comprising:
 providing a circuit board plate, wherein the circuit board plate comprises a surface and a conductive through hole passing through the surface and the circuit board plate, wherein the conductive through hole have a conductive layer disposed on a wall thereof; 
 disposing a conductive ring on the surface, wherein the conductive ring surrounds an opening of the conductive through hole located on the surface and electrically connects to the conductive layer; 
 disposing a solder mask on the surface, wherein the conductive ring is exposed outside of the solder mask; and 
 disposing at least one insulating pad having a thickness onto the solder mask or the surface of the circuit board plate, wherein the at least one insulating pad sited at periphery of the conductive ring, wherein the at least one insulating pad is a non-closed ring, and the conductive ring is located within the non-closed ring. 
 
     
     
       17. The manufacturing method of  claim 16 , further comprising:
 placing a solder coating tool onto the circuit board plate, wherein the solder coating tool is configured to contact the at least one insulating pad to space a distance from the conductive ring, and the solder coating tool comprises an opening corresponding to the conductive ring; 
 injecting a solder into the opening, a space surrounded by the at least one insulating pad and the conductive through hole; 
 placing an electronic component onto the solder, wherein the electronic component is a dual in-line package; and 
 performing a reflow to fix the electronic component to the circuit board plate. 
 
     
     
       18. The manufacturing method of  claim 16 , wherein the at least one insulating pad independently surrounds a corresponding one of the conductive ring. 
     
     
       19. The manufacturing method of  claim 16 , wherein the at least one insulating pad surrounds a corresponding plurality of the conductive rings. 
     
     
       20. The manufacturing method of  claim 16 , wherein the at least one insulating pad comprises a plurality of insulating pads distributed at periphery of the conductive ring. 
     
     
       21. The manufacturing method of  claim 20 , wherein one conductive ring is jointly surrounded by the plurality of insulating pads. 
     
     
       22. The manufacturing method of  claim 20 , wherein the plurality of insulating pads jointly surrounds a corresponding plurality of the conductive rings. 
     
     
       23. The manufacturing method of  claim 16 , wherein a material of the insulating pad comprises a silkscreen. 
     
     
       24. The manufacturing method of  claim 23 , wherein a color of the silkscreen is different from a color of the solder mask. 
     
     
       25. The manufacturing method of  claim 16 , wherein a distance between each of the at least one insulating pad and a center of the conductive through hole is greater than a radius of the conductive ring. 
     
     
       26. A manufacturing method of a circuit board, comprising:
 providing a circuit board plate, wherein the circuit board plate comprises a surface and a conductive through hole passing through the surface and the circuit board plate, wherein the conductive through hole have a conductive layer disposed on a wall thereof; 
 disposing a conductive ring on the surface, wherein the conductive ring surrounds an opening of the conductive through hole located on the surface and electrically connects to the conductive layer; 
 disposing a solder mask on the surface, wherein the conductive ring is exposed outside of the solder mask; and 
 disposing at least one insulating pad having a thickness onto the solder mask or the surface of the circuit board plate, wherein the at least one insulating pad sited at periphery of the conductive ring, wherein the at least one insulating pad comprises a plurality of insulating pads distributed at periphery of the conductive ring. 
 
     
     
       27. The manufacturing method of  claim 26 , further comprising:
 placing a solder coating tool onto the circuit board plate, wherein the solder coating tool is configured to contact the at least one insulating pad to space a distance from the conductive ring, and the solder coating tool comprises an opening corresponding to the conductive ring; 
 injecting a solder into the opening, a space surrounded by the at least one insulating pad and the conductive through hole; 
 placing an electronic component onto the solder, wherein the electronic component is a dual in-line package; and 
 performing a reflow to fix the electronic component to the circuit board plate. 
 
     
     
       28. The manufacturing method of  claim 26 , wherein one conductive ring is jointly surrounded by the plurality of insulating pads. 
     
     
       29. The manufacturing method of  claim 26 , wherein the plurality of insulating pads jointly surrounds a corresponding plurality of the conductive rings. 
     
     
       30. The manufacturing method of  claim 26 , wherein a material of the insulating pad comprises a silkscreen. 
     
     
       31. The manufacturing method of  claim 30 , wherein a color of the silkscreen is different from a color of the solder mask. 
     
     
       32. The manufacturing method of  claim 26 , wherein a distance between each of the at least one insulating pad and a center of the conductive through hole is greater than a radius of the conductive ring.