Inventor · disambiguated record
Zhonghua Yao
Also filed as: YAO ZHONGHUA
23 granted patents·5 pending applications·402 citations·filing 1999–2023
96Inventor score
Top patents by PatentIndex Score
28 records- 0198US11087989B1Cryogenic atomic layer etch with noble gasesAPPLIED MATERIALS INC·Filed 2020·Granted Aug 10, 2021·8 cites·20 claims
- 0295US12334354B2Sidewall passivation for plasma etchingAPPLIED MATERIALS INC·Filed 2022·Granted Jun 17, 2025·2 cites·19 claims
- 0394US11515166B2Cryogenic atomic layer etch with noble gasesAPPLIED MATERIALS INC·Filed 2021·Granted Nov 29, 2022·2 cites·20 claims
- 0493US6736676B2Low-profiled electrical connector with improved housingHON HAI PREC IND CO LTD·Filed 2002·Granted May 18, 2004·68 cites·13 claims
- 0591US6685486B1Low-profiled electrical connector with improved terminalsHON HAI PREC IND CO LTD·Filed 2002·Granted Feb 3, 2004·57 cites·1 claims
- 0691US6238241B1Stacked electrical connector assemblyHON HAI PREC IND CO LTD·Filed 1999·Granted May 29, 2001·73 cites·1 claims
- 0783US6347961B2Electrical connector assembly with improved shielding structureHON HAI PREC IND CO LTD·Filed 2000·Granted Feb 19, 2002·35 cites·6 claims
- 0879US11996294B2Cryogenic atomic layer etch with noble gasesAPPLIED MATERIALS INC·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 0978US12469715B2Dry etching with etch byproduct self-cleaningAPPLIED MATERIALS INC·Filed 2023·Granted Nov 11, 2025·0 cites·12 claims
- 1078US11339085B2Glass fiber composition, glass fiber and composite material thereofJUSHI GROUP CO LTD·Filed 2017·Granted May 24, 2022·1 cites·14 claims
- 1178US6364700B1Electrical connector assemblyHON HAI PREC IND CO LTD·Filed 2000·Granted Apr 2, 2002·29 cites·1 claims
- 1272US6435912B1Electrical connector with improved terminal arrangement and structureHON HAI PREC IND CO LTD·Filed 2000·Granted Aug 20, 2002·21 cites·2 claims
- 1370US11884575B2Glass fiber composition, glass fiber and composite material thereofJUSHI GROUP CO LTD·Filed 2022·Granted Jan 30, 2024·0 cites·15 claims
- 1470USD478552SElectrical connectorHON HAI PREC IND CO LTD·Filed 2002·Granted Aug 19, 2003·16 cites·1 claims
- 1568US6227880B1Stacked electrical connector with a single grounding deviceHON HAI PREC IND CO LTD·Filed 1999·Granted May 8, 2001·26 cites·1 claims
- 1667USD433667SElectrical connectorHON HAI PREC IND CO LTD·Filed 2000·Granted Nov 14, 2000·15 cites·1 claims
- 1766US6224422B1Electrical connectorHON HAI PREC IND CO LTD·Filed 1999·Granted May 1, 2001·24 cites·1 claims
- 1863US2024391821A1Low-density high-performance glass fiber composition, glass fiber and composite material thereofJUSHI GROUP CO LTD·Filed 2023·Application pending·0 cites
- 1958US2025069895A1Methods of etching silicon-and-oxygen-containing features at low temperaturesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2057USD465768SElectrical connectorHON HAI PREC IND CO LTD·Filed 2001·Granted Nov 19, 2002·9 cites·1 claims
- 2153USD447116SElectrical connectorHON HAI PREC IND CO LTD·Filed 2000·Granted Aug 28, 2001·8 cites·1 claims
- 2252US6293822B1Electrical connectorHON HAI PREC IND CO LTD·Filed 2000·Granted Sep 25, 2001·8 cites·1 claims
- 2352US2022306521A1High-modulus glass fiber composition, glass fiber and composite material thereofJUSHI GROUP CO LTD·Filed 2020·Application pending·0 cites
- 2452US2022306520A1High-modulus glass fiber composition, glass fiber and composite material thereofJUSHI GROUP CO LTD·Filed 2020·Application pending·0 cites
- 2551US11919802B2Electronic-grade glass fiber composition, and glass fiber and electronic fabric thereofJUSHI GROUP CO LTD·Filed 2019·Granted Mar 5, 2024·0 cites·20 claims
- 2650US11521849B2In-situ deposition processAPPLIED MATERIALS INC·Filed 2019·Granted Dec 6, 2022·0 cites·16 claims
- 2749US11643360B2Electronic-grade glass fiber composition, and glass fiber and electronic fabric thereofJUSHI GROUP CO LTD·Filed 2019·Granted May 9, 2023·0 cites·18 claims
- 2844US2020373149A1In-situ atomic layer deposition processAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →