Inventor · disambiguated record
Zhan Ying
Also filed as: YING ZHAN
61 granted patents·11 pending applications·39 citations·filing 2018–2024
97Inventor score
Files withCHANGXIN MEMORY TECH INC56UNIV ANHUI9JCET MAN CO LTD3ERICSSON TELEFON AB L M2SEMICONDUCTOR MFG INT BEIJING CORP1
Top patents by PatentIndex Score
72 records- 0196US11527301B2Method for reading and writing and memory deviceCHANGXIN MEMORY TECH INC·Filed 2021·Granted Dec 13, 2022·8 cites·12 claims
- 0295US11599417B2Error correction systemCHANGXIN MEMORY TECH INC·Filed 2022·Granted Mar 7, 2023·5 cites·17 claims
- 0394US12051699B2Semiconductor structure and method for forming sameCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jul 30, 2024·2 cites·19 claims
- 0494US11315610B1Sense amplifier, memory and method for controlling sense amplifierUNIV ANHUI·Filed 2020·Granted Apr 26, 2022·6 cites·18 claims
- 0592US11894047B2Sense amplifier, memory and method for controlling sense amplifierUNIV ANHUI·Filed 2020·Granted Feb 6, 2024·5 cites·18 claims
- 0691US11820058B2Injection mould and injection moulding methodCHANGXIN MEMORY TECH INC·Filed 2021·Granted Nov 21, 2023·2 cites·13 claims
- 0790US11887655B2Sense amplifier, memory, and method for controlling sense amplifier by configuring structures using switchesUNIV ANHUI·Filed 2021·Granted Jan 30, 2024·3 cites·20 claims
- 0889US11632113B2Enable control circuit and semiconductor memoryCHANGXIN MEMORY TECH INC·Filed 2022·Granted Apr 18, 2023·2 cites·20 claims
- 0986US11854938B2Electrostatic protection device and electrostatic protection circuitCHANGXIN MEMORY TECH INC·Filed 2021·Granted Dec 26, 2023·1 cites·19 claims
- 1085US11894420B2Memory and formation method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted Feb 6, 2024·1 cites·12 claims
- 1184US11423957B2Sense amplifier, memory and method for controlling a sense amplifierUNIV ANHUI·Filed 2020·Granted Aug 23, 2022·2 cites·15 claims
- 1281US11899971B2Method for reading and writing and memory deviceCHANGXIN MEMORY TECH INC·Filed 2021·Granted Feb 13, 2024·1 cites·10 claims
- 1379US11862285B2Sense amplifier, memory and control method of sense amplifierUNIV ANHUI·Filed 2021·Granted Jan 2, 2024·1 cites·18 claims
- 1463US12033911B2Semiconductor structure having a groove located in the semiconductor substrate and connected to the heat transfer layerCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 1560US12183585B2Manufacturing method of semiconductor structure including complementary first and second mask patternsCHANGXIN MEMORY TECH INC·Filed 2021·Granted Dec 31, 2024·0 cites·15 claims
- 1660US12041766B2Manufacturing method of semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jul 16, 2024·0 cites·19 claims
- 1760US12004287B2Printed circuit boardERICSSON TELEFON AB L M·Filed 2020·Granted Jun 4, 2024·0 cites·16 claims
- 1860US12002748B2Contact window structure, metal plug and forming method thereof, and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jun 4, 2024·0 cites·11 claims
- 1960US11856748B2Semiconductor memory preparation method and semiconductor memoryCHANGXIN MEMORY TECH INC·Filed 2021·Granted Dec 26, 2023·0 cites·15 claims
- 2059US12354941B2Chip package structure and storage systemCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jul 8, 2025·0 cites·15 claims
- 2159US11928357B2Method and system for adjusting memory, and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2022·Granted Mar 12, 2024·0 cites·13 claims
- 2259US11869801B2Semiconductor manufacturing methodCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jan 9, 2024·0 cites·20 claims
- 2358US12295151B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted May 6, 2025·0 cites·10 claims
- 2458US12131951B2Semiconductor packaging method and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Oct 29, 2024·0 cites·17 claims
- 2558US12127395B2Semiconductor structure and semiconductor structure manufacturing methodCHANGXIN MEMORY TECH INC·Filed 2022·Granted Oct 22, 2024·0 cites·13 claims
- 2657US12389591B2Semiconductor structure and method for manufacturing semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Aug 12, 2025·0 cites·15 claims
- 2757US11867758B2Test method for control chip and related deviceCHANGXIN MEMORY TECH INC·Filed 2020·Granted Jan 9, 2024·0 cites·16 claims
- 2857US11482446B1Method for manufacturing semiconductor device and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2021·Granted Oct 25, 2022·0 cites·18 claims
- 2956US12238919B2Semiconductor structure and semiconductor structure manufacturing methodCHANGXIN MEMORY TECH INC·Filed 2021·Granted Feb 25, 2025·0 cites·12 claims
- 3056US12193218B2Semiconductor structure and method for manufacturing semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jan 7, 2025·0 cites·16 claims
- 3155US12419105B2Protection ring, method for forming protection ring, and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Sep 16, 2025·0 cites·16 claims
- 3255US12094804B2Method of manufacturing a semiconductor device and a semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2021·Granted Sep 17, 2024·0 cites·15 claims
- 3355US11929112B2Sense amplifier, memory, and method for controlling sense amplifierUNIV ANHUI·Filed 2021·Granted Mar 12, 2024·0 cites·19 claims
- 3455US11735279B2Programmable memory cell, memory array and reading and writing method thereofCHANGXIN MEMORY TECH INC·Filed 2020·Granted Aug 22, 2023·0 cites·15 claims
- 3554US12302634B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted May 13, 2025·0 cites·9 claims
- 3654US12009250B2Semiconductor device and a method making the sameCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jun 11, 2024·0 cites·19 claims
- 3754US11955383B2Semiconductor device and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted Apr 9, 2024·0 cites·9 claims
- 3854US11915967B2Method for manufacturing semiconductor device and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2021·Granted Feb 27, 2024·0 cites·18 claims
- 3953US12176350B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted Dec 24, 2024·0 cites·15 claims
- 4053US12119350B2Semiconductor structure and method for forming semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Oct 15, 2024·0 cites·19 claims
- 4153US11990451B2Method for packaging semiconductor, semiconductor package structure, and packageCHANGXIN MEMORY TECH INC·Filed 2021·Granted May 21, 2024·0 cites·20 claims
- 4253US11922023B2Read/write method and memory deviceCHANGXIN MEMORY TECH INC·Filed 2020·Granted Mar 5, 2024·0 cites·15 claims
- 4353US11914417B2MemoryCHANGXIN MEMORY TECH INC·Filed 2022·Granted Feb 27, 2024·0 cites·16 claims
- 4453US11862268B2Test method for control chip and related deviceCHANGXIN MEMORY TECH INC·Filed 2020·Granted Jan 2, 2024·0 cites·20 claims
- 4553US11749674B2Electrostatic discharge protection circuitCHANGXIN MEMORY TECH INC·Filed 2022·Granted Sep 5, 2023·0 cites·16 claims
- 4653US2020006654A1Non-volatile memory and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2019·Application pending·0 cites
- 4753US2025006685A1Semiconductor packages with multiple types of conductive componentsJCET MAN CO LTD·Filed 2024·Application pending·0 cites
- 4853US2025006585A1Semiconductor packages with multiple types of conductive componentsJCET MAN CO LTD·Filed 2024·Application pending·0 cites
- 4953US2025006682A1Semiconductor packages with multiple types of solder ballsJCET MAN CO LTD·Filed 2024·Application pending·0 cites
- 5052US12342523B2Method for manufacturing memory and memoryCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jun 24, 2025·0 cites·10 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →