Inventor · disambiguated record
Ziqing Duan
Also filed as: DUAN ZIQING
35 granted patents·6 pending applications·191 citations·filing 2014–2023
96Inventor score
Top patents by PatentIndex Score
41 records- 0198US10886172B2Methods for wordline separation in 3D-NAND devicesAPPLIED MATERIALS INC·Filed 2020·Granted Jan 5, 2021·8 cites·20 claims
- 0298US10083834B2Methods of forming self-aligned viasAPPLIED MATERIALS INC·Filed 2017·Granted Sep 25, 2018·64 cites·15 claims
- 0397US10319604B2Methods for self-aligned patterningAPPLIED MATERIALS INC·Filed 2017·Granted Jun 11, 2019·20 cites·19 claims
- 0497US10319636B2Deposition and treatment of films for patterningAPPLIED MATERIALS INC·Filed 2017·Granted Jun 11, 2019·21 cites·16 claims
- 0596US10354916B2Methods for wordline separation in 3D-NAND devicesAPPLIED MATERIALS INC·Filed 2018·Granted Jul 16, 2019·12 cites·20 claims
- 0695US10622251B2Methods for wordline separation in 3D-NAND devicesAPPLIED MATERIALS INC·Filed 2019·Granted Apr 14, 2020·8 cites·13 claims
- 0794US11728168B2Ultra-high modulus and etch selectivity boron-carbon hardmask filmsAPPLIED MATERIALS INC·Filed 2021·Granted Aug 15, 2023·2 cites·18 claims
- 0893US10192775B2Methods for gapfill in high aspect ratio structuresAPPLIED MATERIALS INC·Filed 2017·Granted Jan 29, 2019·7 cites·13 claims
- 0992US10418243B2Ultra-high modulus and etch selectivity boron-carbon hardmask filmsAPPLIED MATERIALS INC·Filed 2016·Granted Sep 17, 2019·6 cites·20 claims
- 1091US10636659B2Selective deposition for simplified process flow of pillar formationAPPLIED MATERIALS INC·Filed 2018·Granted Apr 28, 2020·7 cites·9 claims
- 1189US10100408B2Edge hump reduction faceplate by plasma modulationAPPLIED MATERIALS INC·Filed 2015·Granted Oct 16, 2018·6 cites·18 claims
- 1288US10410872B2Borane mediated dehydrogenation process from silane and alkylsilane species for spacer and hardmask applicationAPPLIED MATERIALS INC·Filed 2017·Granted Sep 10, 2019·5 cites·16 claims
- 1388US9711360B2Methods to improve in-film particle performance of amorphous boron-carbon hardmask process in PECVD systemAPPLIED MATERIALS INC·Filed 2016·Granted Jul 18, 2017·5 cites·20 claims
- 1486US9390910B2Gas flow profile modulated control of overlay in plasma CVD filmsAPPLIED MATERIALS INC·Filed 2014·Granted Jul 12, 2016·5 cites·20 claims
- 1585US10403542B2Methods of forming self-aligned vias and air gapsAPPLIED MATERIALS INC·Filed 2018·Granted Sep 3, 2019·4 cites·19 claims
- 1685US10319591B2Geometric control of bottom-up pillars for patterning applicationsAPPLIED MATERIALS INC·Filed 2017·Granted Jun 11, 2019·3 cites·20 claims
- 1783US12211694B2Ultra-high modulus and etch selectivity boron-carbon hardmask filmsAPPLIED MATERIALS INC·Filed 2023·Granted Jan 28, 2025·0 cites·19 claims
- 1882US10373822B2Gas flow profile modulated control of overlay in plasma CVD filmsAPPLIED MATERIALS INC·Filed 2017·Granted Aug 6, 2019·2 cites·18 claims
- 1979US10854511B2Methods of lowering wordline resistanceAPPLIED MATERIALS INC·Filed 2018·Granted Dec 1, 2020·2 cites·14 claims
- 2077US10559497B2Seamless tungsten fill by tungsten oxidation-reductionAPPLIED MATERIALS INC·Filed 2018·Granted Feb 11, 2020·2 cites·15 claims
- 2172US11488856B2Methods for gapfill in high aspect ratio structuresAPPLIED MATERIALS INC·Filed 2020·Granted Nov 1, 2022·0 cites·15 claims
- 2271US10840186B2Methods of forming self-aligned vias and air gapsAPPLIED MATERIALS INC·Filed 2019·Granted Nov 17, 2020·1 cites·11 claims
- 2371US9837265B2Gas flow profile modulated control of overlay in plasma CVD filmsAPPLIED MATERIALS INC·Filed 2016·Granted Dec 5, 2017·1 cites·7 claims
- 2464US10971364B2Ultra-high modulus and etch selectivity boron carbon hardmask filmsAPPLIED MATERIALS INC·Filed 2018·Granted Apr 6, 2021·0 cites·15 claims
- 2563US10811303B2Methods for gapfill in high aspect ratio structuresAPPLIED MATERIALS INC·Filed 2019·Granted Oct 20, 2020·0 cites·9 claims
- 2661US11094544B2Methods of forming self-aligned viasAPPLIED MATERIALS INC·Filed 2019·Granted Aug 17, 2021·0 cites·4 claims
- 2760US10930475B2Graded in-situ charge trapping layers to enable electrostatic chucking and excellent particle performance for boron-doped carbon filmsAPPLIED MATERIALS INC·Filed 2018·Granted Feb 23, 2021·0 cites·20 claims
- 2860US2021013038A1Methods of Forming Tungsten PillarsAPPLIED MAERIALS INC·Filed 2020·Application pending·0 cites
- 2959US10410865B2Methods of forming self-aligned viasAPPLIED MATERIALS INC·Filed 2018·Granted Sep 10, 2019·0 cites·17 claims
- 3059US2024142684A1Color Coatings Having Diamond-Like Carbon LayerAPPLE INC·Filed 2023·Application pending·0 cites
- 3158US10930503B2Geometric control of bottom-up pillars for patterning applicationsAPPLIED MATERIALS INC·Filed 2019·Granted Feb 23, 2021·0 cites·15 claims
- 3258US10699952B2Deposition and treatment of films for patterningAPPLIED MATERIALS INC·Filed 2019·Granted Jun 30, 2020·0 cites·20 claims
- 3356US10784107B2Methods of forming tungsten pillarsAPPLIED MATERIALS INC·Filed 2018·Granted Sep 22, 2020·0 cites·12 claims
- 3456US2019252206A1Methods For Self-Aligned PatterningAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 3555US2025085463A1Color Coatings with Two-Layer Thin-Film Interference FilterAPPLE INC·Filed 2023·Application pending·0 cites
- 3654US10128088B2Graded in-situ charge trapping layers to enable electrostatic chucking and excellent particle performance for boron-doped carbon filmsAPPLIED MATERIALS INC·Filed 2016·Granted Nov 13, 2018·0 cites·20 claims
- 3750US10770349B2Critical dimension control for self-aligned contact patterningAPPLIED MATERIALS INC·Filed 2018·Granted Sep 8, 2020·0 cites·20 claims
- 3848US11011371B2SiBN film for conformal hermetic dielectric encapsulation without direct RF exposure to underlying structure materialAPPLIED MATERIALS INC·Filed 2017·Granted May 18, 2021·0 cites·19 claims
- 3945US10490411B2Method for enabling self-aligned lithography on metal contacts and selective deposition using free-standing vertical carbon structuresAPPLIED MATERIALS INC·Filed 2017·Granted Nov 26, 2019·0 cites·17 claims
- 4037US2017178758A1Uniform wafer temperature achievement in unsymmetric chamber environmentAPPLIED MATERIALS INC·Filed 2016·Application pending·0 cites
- 4137US2017162417A1Method and apparatus for clamping and declamping substrates using electrostatic chucksAPPLIED MATERIALS INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →