Inventor · disambiguated record

Ziqun Hua

Also filed as: HUA ZIQUN

13 granted patents·16 pending applications·9 citations·filing 2019–2025

84Inventor score

Technology areasH10W H10B H10D H10N H10P

Files withYANGTZE MEMORY TECH CO LTD29

Top patents by PatentIndex Score

29 records

0193US12176310B2Memory devices having vertical transistors and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Dec 24, 2024·2 cites·20 claims
0289US12349341B2Memory devices having vertical transistors and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 1, 2025·1 cites·20 claims
0386US2025349792A1Method of forming semiconductor structureYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
0481US10811380B2Semiconductor structure and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Oct 20, 2020·3 cites·16 claims
0578US10818631B2Semiconductor structure and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Oct 27, 2020·3 cites·16 claims
0675US2025070065A1Memory devices having vertical transistors and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
0771US12394751B2Method of forming semiconductor structureYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 19, 2025·0 cites·19 claims
0871US2025287583A1Memory devices having vertical transistors and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
0971US2025015015A1Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
1070US2023380142A1Memory devices having vertical transistors and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
1169US2022216178A1Semiconductor structure and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
1268US12362223B2Semiconductor structure, fabrication method and three-dimensional memoryYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·18 claims
1368US2023005873A1Semiconductor structure and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
1466US12136599B2Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Nov 5, 2024·0 cites·18 claims
1564US2021398932A1Semiconductor structure and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Application pending·0 cites
1663US12507406B23D memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
1759US12376307B2Semiconductor structure, fabrication method and three-dimensional memoryYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
1858US2021335745A1Semiconductor structure and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Application pending·0 cites
1956US2020006285A1Semiconductor structure and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Application pending·0 cites
2055US12048151B2Methods for forming three-dimensional memory devices with backside source contactsYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jul 23, 2024·0 cites·20 claims
2155US2024215241A1Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
2254US11963349B2Methods for forming three-dimensional memory devices with backside source contactsYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Apr 16, 2024·0 cites·20 claims
2353US12446265B2Semiconductor devices and methods for manufacturing the same, and NAND memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
2453US2020006275A1Semiconductor structure and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Application pending·0 cites
2553US2024196589A1Memory device and manufacturing method thereofYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
2652US12324198B2Semiconductor device and manufacture method thereofYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
2752US2020006284A1Semiconductor structure and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Application pending·0 cites
2851US2024188275A1Memory device and manufacturing method thereofYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
2950US2023371244A1Memory device having vertical transistors and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →