Inventor · disambiguated record
Ziyin Lin
Also filed as: LIN ZIYIN
8 granted patents·77 pending applications·5 citations·filing 2018–2024
76Inventor score
Top patents by PatentIndex Score
85 records- 0178US11282717B2Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gapINTEL CORP·Filed 2018·Granted Mar 22, 2022·2 cites·12 claims
- 0277US12068222B2Dummy die structures of a packaged integrated circuit deviceINTEL CORP·Filed 2020·Granted Aug 20, 2024·1 cites·15 claims
- 0375US11688634B2Trenches in wafer level packages for improvements in warpage reliability and thermalsINTEL CORP·Filed 2019·Granted Jun 27, 2023·2 cites·27 claims
- 0469US11776821B2Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gapINTEL CORP·Filed 2022·Granted Oct 3, 2023·0 cites·19 claims
- 0569US2024402445A1Hydrophobic feature to control adhesive flowINTEL CORP·Filed 2024·Application pending·0 cites
- 0667US2024270929A1Capillary underfill formulations that include carbon nanotubes, containers, and methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 0762US12130482B2Hydrophobic feature to control adhesive flowINTEL CORP·Filed 2020·Granted Oct 29, 2024·0 cites·19 claims
- 0861US2025105074A1Glass cores including protruding through glass vias and related methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 0958US2025218999A1Passive component assembly for thickness modification to match core thicknessINTEL CORP·Filed 2023·Application pending·0 cites
- 1058US2025218998A1Low temperature solder interconnect for package pitch scalingINTEL CORP·Filed 2023·Application pending·0 cites
- 1157US2025110295A1Polyethylene oxide-based optical adhesiveINTEL CORP·Filed 2023·Application pending·0 cites
- 1257US2025219028A1Deep trench capacitors in multi-core integrated circuit device package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1357US2025309030A1Microelectronic structures including ihs coupling enhancement structures for thermal degradation mitigationINTEL CORP·Filed 2024·Application pending·0 cites
- 1457US2025210426A1Microelectronic assemblies with strengthened glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1557US2025149414A1Low z-height separable liquid metal based electrical interconnectINTEL CORP·Filed 2023·Application pending·0 cites
- 1657US2025220818A1Flow enhanced dummy structure to enable capillary flow based sidewall fillingINTEL CORP·Filed 2023·Application pending·0 cites
- 1757US2025218964A1Technologies for connected components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 1857US2025306303A1Photonic integrated circuit packages including an on-package expanded beam connector for detachable fiber arrayINTEL CORP·Filed 2024·Application pending·0 cites
- 1957US2025218958A1Pedestals for semiconductor components embedded in package substrates and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 2057US2025218904A1Technologies for power and spacer components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 2157US2025218880A1Microelectronic assemblies with pillar-first conductive via formation in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 2257US2025218960A1Methods and apparatus to embed semiconductor devices in cores of package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2357US2025218926A1Microelectronic assemblies including cavity-less encapsulated diesINTEL CORP·Filed 2023·Application pending·0 cites
- 2456US2025306297A1Package with optical connectorINTEL CORP·Filed 2024·Application pending·0 cites
- 2556US2025306312A1Photonic integrated circuit packages including a barrier material to confine a thermal interface materialINTEL CORP·Filed 2024·Application pending·0 cites
- 2656US2025273607A1Methods and architectures for shallow fiducial and metal defined pad designsINTEL CORP·Filed 2024·Application pending·0 cites
- 2756US2025219021A1Vertically embedded components in package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2856US2025306304A1Fiber array unit for high density optical fiber connections to photonic integrated circuit shorelinesINTEL CORP·Filed 2024·Application pending·0 cites
- 2956US2025362456A1Graded index (grin) lens expanded beam (eb) coupler for detachable fiber array unit (fau)INTEL CORP·Filed 2024·Application pending·0 cites
- 3056US2025112085A1Apparatus and methods for capillary underfill of embedded devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 3156US2025183180A1Direct bonding for embedded bridges with viasINTEL CORP·Filed 2023·Application pending·0 cites
- 3256US2025079278A1Liquid metal socket interconnects with liquid passivation layer and filler materialsINTEL CORP·Filed 2023·Application pending·0 cites
- 3356US2025218957A1Methods and apparatus to embed a semiconductor device in a glass coreINTEL CORP·Filed 2023·Application pending·0 cites
- 3456US2025306313A1Heat spreaders for optical fiber array interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 3555US2025306307A1Sinterable nanoparticles for organic-free optical adhesivesINTEL CORP·Filed 2024·Application pending·0 cites
- 3655US2025306290A1Expanded beam optical coupling with a ball lensINTEL CORP·Filed 2024·Application pending·0 cites
- 3755US2025218906A1Reconstituted passive assemblies for embedding in thick coresINTEL CORP·Filed 2023·Application pending·0 cites
- 3855US2025106983A1Stiffener architectures for glass edge protectionINTEL CORP·Filed 2023·Application pending·0 cites
- 3955US2025112164A1Controlling substrate bump heightINTEL CORP·Filed 2023·Application pending·0 cites
- 4054US2024222301A1Methods and apparatus for optical thermal treatment in semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 4154US2024222136A1Electrical layer with roughened surfacesINTEL CORP·Filed 2022·Application pending·0 cites
- 4254US2024312865A1Methods, systems, apparatus, and articles of manufacture to improve reliability of vias in a glass substrate of an integrated circuit packageINTEL CORP·Filed 2023·Application pending·0 cites
- 4354US2024332125A12d fillers for reduced cte for pidINTEL CORP·Filed 2023·Application pending·0 cites
- 4454US2024388018A1Liquid metal patch interconnect for large warpage componentsINTEL CORP·Filed 2023·Application pending·0 cites
- 4554US2025306306A1Lid design, materials and process for passive fau alignment in co-package opticsINTEL CORP·Filed 2024·Application pending·0 cites
- 4654US2024363520A1Self-healing cap for liquid metal containment in socket applicationsINTEL CORP·Filed 2023·Application pending·0 cites
- 4754US2025102744A1Technologies for fiber array unit lid designsINTEL CORP·Filed 2023·Application pending·0 cites
- 4853US11749585B2High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit packageINTEL CORP·Filed 2020·Granted Sep 5, 2023·0 cites·20 claims
- 4953US11676876B2Semiconductor die package with warpage management and process for forming suchINTEL CORP·Filed 2019·Granted Jun 13, 2023·0 cites·26 claims
- 5053US2024213116A1Methods, systems, apparatus, and articles of manufacture to cool integrated circuit packages having glass substratesINTEL CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 85 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →