Inventor · name-matched record
BAO JUNJING
0 granted patents·6 pending applications·0 citations·filing 2024–2024
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
6 records- 0164US2026101734A1Fully self-aligned via (fsav) on subtractive metalQUALCOMM INCORPORATED·Filed 2024·Application pending·0 cites
- 0264US2026082901A1Metallization airgap for subtractive metal processQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0363US2026082669A1Integrated circuits that include germanide layer(s) in backside contacts to transistor devices formed in the integrated circuit (ic)QUALCOMM INC·Filed 2024·Application pending·0 cites
- 0462US2026082629A1High-temperature silicide contact for backside source/drain contactsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0558US2026090059A1Semiconductor die including a transistor coupled to a contact layer wherein the contact layer includes a metal contact having a sidewall with a reduced height to promote connectivity with an adjacent viaQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0656US2026068296A1Semiconductor die including a transistor coupled to a contact layer wherein the contact layer includes a metal contact having a sidewall with a reduced height to promote connectivity with an adjacent viaQUALCOMM INC·Filed 2024·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when BAO JUNJING files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →