Inventor · name-matched record

BEH DANIEL WEI MING

1 granted patent·1 pending application·0 citations·filing 2024–2025

8Inventor score

Technology areasC23C H10D

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

Top patents by PatentIndex Score

2 records

0169US12571100B2Atomic layer deposition of molybdenum silicide thin filmsAPPLIED MATERIALS INC·Filed 2024·Granted Mar 10, 2026·0 cites·20 claims
0254US2026032985A1Selective deposition of high-k dielectric material in gate interfaceAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites

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Identity basis: exact name match across USPTO filings. How scoring works →