Inventor · name-matched record
CHEN HSIEN-WEI
4 granted patents·6 pending applications·1 citations·filing 2021–2025
62Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
10 records- 0196US2026086298A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0295US12517311B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 6, 2026·1 cites·20 claims
- 0391US2026082841A1Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0483US12581985B2Pad design for reliability enhancement in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 17, 2026·0 cites·20 claims
- 0578US12543571B2Method of making package including stress relief structures and packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 3, 2026·0 cites·20 claims
- 0672US12538819B2Inductor RF isolation structure in an interposer and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 27, 2026·0 cites·20 claims
- 0769US2026038930A1Coin cell battery holder with safety mechanismsDELL PRODUCTS LP·Filed 2024·Application pending·0 cites
- 0868US2026082922A1Semiconductor device including stress control layer and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0962US2026096442A1Semiconductor packages and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1059US2026033353A1Redistribution structures with seal rings and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →