Inventor · name-matched record
CHEN JACK
4 granted patents·0 citations·filing 2021–2022
52Inventor score
Files withLAM RES CORP4
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0156US12542259B2Plasma-exclusion-zone rings for processing notched wafersLAM RES CORP·Filed 2021·Granted Feb 3, 2026·0 cites·38 claims
- 0254US12538747B2Frontside and backside pressure monitoring for substrate movement preventionLAM RES CORP·Filed 2022·Granted Jan 27, 2026·0 cites·34 claims
- 0352US12525434B2Arcing reduction in wafer bevel edge plasma processingLAM RES CORP·Filed 2021·Granted Jan 13, 2026·0 cites·20 claims
- 0449US12550687B2Wafer edge deposition for wafer level packagingLAM RES CORP·Filed 2021·Granted Feb 10, 2026·0 cites·26 claims
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Identity basis: exact name match across USPTO filings. How scoring works →