Inventor · name-matched record
CHEN MING-FA
6 granted patents·15 pending applications·1 citations·filing 2020–2025
68Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
21 records- 0196US2026086298A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0295US12517311B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 6, 2026·1 cites·20 claims
- 0392US2026033314A1Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0491US2026076223A1Semiconductor structure and method manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0591US2026082841A1Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0691US2026090409A1Semiconductor structure and method manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0784US2026060113A1Semiconductor packages and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0880US12564108B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 24, 2026·0 cites·20 claims
- 0980US12533766B2Simplified carrier removable by reduced number of CMP processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 27, 2026·0 cites·20 claims
- 1067US12588482B2Method for forming semiconductor redistribution structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 24, 2026·0 cites·20 claims
- 1164US12517076B2Gas detectorIND TECH RES INST·Filed 2022·Granted Jan 6, 2026·0 cites·14 claims
- 1263US2026003145A1Photonic engine with facets and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1363US2026050106A1Optical device with antireflection coating film and recessed silicon microlensTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1463US2026075984A1Semiconductor package and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1563US2026003139A1Optical devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1662US2026036769A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1762US2026005207A1Semiconductor package with adiabatic well structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1855US2026079309A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1954US2026003128A1Optical devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2054US2026086300A1Semiconductor device and forming method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2147US12538814B2Semiconductor structure with a bridge embedded therein and method manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 27, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →