Inventor · name-matched record
CHUANG LING-YI
3 granted patents·2 pending applications·0 citations·filing 2022–2025
38Inventor score
Technology areasH10W
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0181US2026101802A1Multi-dies structure, multi-dies package structure and package structureCHANGXIN MEMORY TECH INC·Filed 2025·Application pending·0 cites
- 0263US2026047417A1Semiconductor packageCXMT CORP·Filed 2025·Application pending·0 cites
- 0352US12525575B2Semiconductor package structure and method for preparing sameCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jan 13, 2026·0 cites·13 claims
- 0450US12593671B2Semiconductor structure and method for fabricating sameCHANGXIN MEMORY TECH INC·Filed 2023·Granted Mar 31, 2026·0 cites·15 claims
- 0550US12557301B2Method for fabricating semiconductor structure, semiconductor structure, and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2023·Granted Feb 17, 2026·0 cites·13 claims
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Identity basis: exact name match across USPTO filings. How scoring works →