Inventor · name-matched record
CONG ZHEPENG
2 granted patents·9 pending applications·0 citations·filing 2022–2025
23Inventor score
Files withAPPLIED MATERIALS INC11
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
11 records- 0190US2026045458A1Process kits and related methods for processing chambers to facilitate deposition process adjustabilityAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0286US2026092769A1In-situ reflectometry for real-time process controlAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0382US2026043137A1Modular flow chamber kits, processing chambers, and related apparatus and methods applicable for semiconductor manufacturingAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0469US2026068550A1Pulse etching for finfet and gaa source/drain epi film growth controlAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0568US2026062834A1Active sic heating with zonality control for epi chamber thermal profile adjustingAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0666US2026055532A1Chamber and method for controlling film defects at an edge area of a substrateAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0761US12592363B2Actively controlled gas inject for process temperature controlAPPLIED MATERIALS INC·Filed 2023·Granted Mar 31, 2026·0 cites·20 claims
- 0861US2026047375A1Plate flow paths for gas activation, and related chamber kits, methods, and processing chambersAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0958US2026068578A1Spatial gas injection for gas depletion and gas concentration adjustability, and related processing chambers, apparatus, and methodsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1055US12519005B2Thickness uniformity improvement kit for thermally sensitive epitaxial processingAPPLIED MATERIALS INC·Filed 2022·Granted Jan 6, 2026·0 cites·20 claims
- 1153US2026085445A1Flow guide arrangements for gas activation and gas distribution, and related chamber kits, methods, and processing chambersAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →