Inventor · name-matched record
DING DING
5 granted patents·3 pending applications·0 citations·filing 2021–2025
59Inventor score
Files withBEIJING BOE TECHNOLOGY DEV CO LTD3Tencent America LLC3BOE TECHNOLOGY GROUP CO LTD1KLA CORP1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
8 records- 0189US2026077351A1Chip, microfluidic device, and method for sorting target dropletsBEIJING BOE TECHNOLOGY DEV CO LTD·Filed 2025·Application pending·0 cites
- 0274US2026036869A1Method and system for construction of crystals for frequency conversionKLA CORP·Filed 2025·Application pending·0 cites
- 0369US2026084147A1High-throughput test chipBEIJING BOE TECHNOLOGY DEV CO LTD·Filed 2025·Application pending·0 cites
- 0466US12518432B2System, method, and computer program for content adaptive online training for multiple blocks based on certain patternsTencent America LLC·Filed 2022·Granted Jan 6, 2026·0 cites·20 claims
- 0565US12581125B2Truncated bit depth support SEI messagesTencent America LLC·Filed 2024·Granted Mar 17, 2026·0 cites·20 claims
- 0664US12556733B2Efficient neural network decoder for image compressionTencent America LLC·Filed 2024·Granted Feb 17, 2026·0 cites·20 claims
- 0757US12515217B2High-throughput test chipBEIJING BOE TECHNOLOGY DEV CO LTD·Filed 2021·Granted Jan 6, 2026·0 cites·18 claims
- 0853US12589393B2Microfluidic chipBOE TECHNOLOGY GROUP CO LTD·Filed 2021·Granted Mar 31, 2026·0 cites·19 claims
Identity basis: exact name match across USPTO filings. How scoring works →