Inventor · name-matched record
HSU YI-FENG
2 granted patents·2 pending applications·0 citations·filing 2022–2025
25Inventor score
Files withUNITED MICROELECTRONICS CORP4
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0173US2026090477A1Method for forming three-dimensional integrated circuit structureUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0260US12543585B2Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Feb 3, 2026·0 cites·8 claims
- 0354US2026005138A1Package structure and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0452US12525566B2Semiconductor package and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jan 13, 2026·0 cites·18 claims
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Identity basis: exact name match across USPTO filings. How scoring works →