Inventor · name-matched record
IGA HAYATO
6 granted patents·1 pending application·0 citations·filing 2023–2025
62Inventor score
Files withDISCO CORP7
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
7 records- 0170US12538762B2Processing method of bonded waferDISCO CORP·Filed 2023·Granted Jan 27, 2026·0 cites·3 claims
- 0268US12560557B2Inspection method of workpiece and inspection apparatusDISCO CORP·Filed 2023·Granted Feb 24, 2026·0 cites·11 claims
- 0368US12538763B2Bonded wafer processing methodDISCO CORP·Filed 2023·Granted Jan 27, 2026·0 cites·3 claims
- 0466US2026101728A1Wafer processing methodDISCO CORP·Filed 2025·Application pending·0 cites
- 0558US12593642B2Method of processing a waferDISCO CORP·Filed 2023·Granted Mar 31, 2026·0 cites·3 claims
- 0658US12532715B2Processing method of bonded waferDISCO CORP·Filed 2023·Granted Jan 20, 2026·0 cites·3 claims
- 0754US12533830B2Substrate manufacturing methodDISCO CORP·Filed 2023·Granted Jan 27, 2026·0 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when IGA HAYATO files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →