Inventor · name-matched record
ISHIKAWA KENSUKE
2 granted patents·1 pending application·1 citations·filing 2022–2024
30Inventor score
Technology areasH10W
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0185US12550787B2Bonded assembly containing bonding pads with metal oxide barriers and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Feb 10, 2026·1 cites·20 claims
- 0261US2026005132A1Metal interconnect structures and semi-damascene method for forming the sameSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0357US12525487B2High aspect ratio via fill process employing selective metal deposition and structures formed by the sameSANDISK TECHNOLOGIES INC·Filed 2022·Granted Jan 13, 2026·0 cites·19 claims
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Identity basis: exact name match across USPTO filings. How scoring works →