Inventor · name-matched record
KO CHENG-TA
4 granted patents·4 pending applications·0 citations·filing 2022–2025
55Inventor score
Files withUNIMICRON TECHNOLOGY CORP8
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
8 records- 0182US2026083024A1Method for manufacturing package structureUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0279US12563667B2Manufacturing method of circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2024·Granted Feb 24, 2026·0 cites·5 claims
- 0379US2026082950A1Manufacturing method of package structureUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0471US12525522B2Package structure and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Jan 13, 2026·0 cites·9 claims
- 0568US12525542B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Jan 13, 2026·0 cites·7 claims
- 0663US2026068708A1Substrate structureUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0760US2026025920A1Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0859US12568810B2Anti-diffusion substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Mar 3, 2026·0 cites·8 claims
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Identity basis: exact name match across USPTO filings. How scoring works →