Inventor · name-matched record
LAI CHIEN-MING
0 granted patents·2 pending applications·0 citations·filing 2024–2025
Technology areasH10W
Files withUNITED MICROELECTRONICS CORP2
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0181US2026011668A1Semiconductor structure for wafer level bonding and bonded semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0263US2026013147A1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →