Inventor · name-matched record
LIN MOU-SHIUNG
4 granted patents·7 pending applications·42 citations·filing 2003–2025
73Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
11 records- 0194US2026047199A1Logic drive using standard commodity programmable logic ic chips comprising non-volatile random access memory cellsICOMETRUE CO LTD·Filed 2025·Application pending·0 cites
- 0292US2026004035A1Logic drive based on standard commodity fpga ic chipsICOMETRUE CO LTD·Filed 2024·Application pending·0 cites
- 0392US2026050724A1Logic drive based on standard commodity fpga ic chipsICOMETRUE CO LTD·Filed 2024·Application pending·0 cites
- 0488US2026045951A1Logic drive with brain-like elasticity and integrality based on standard commodity fpga ic chips using non-volatile memory cellsICOMETRUE CO LTD·Filed 2024·Application pending·0 cites
- 0587US7282804B2Structure of high performance combo chip and processing methodMEGICA CORP·Filed 2004·Granted Oct 16, 2007·27 cites·12 claims
- 0687US2026074698A1Logic drive using standard commodity programmable logic ic chipsICOMETRUE CO LTD·Filed 2025·Application pending·0 cites
- 0783US2026101751A1Micro heat pipe for use in semiconductor ic chip packageICOMETRUE COMPANY LTD·Filed 2025·Application pending·0 cites
- 0879US2026044658A1Logic drive based on standard commodity fpga ic chipsICOMETRUE CO LTD·Filed 2025·Application pending·0 cites
- 0976US8021976B2Method of wire bonding over active area of a semiconductor circuitMEGICA CORP·Filed 2003·Granted Sep 20, 2011·15 cites·50 claims
- 1064US12519033B2Micro heat pipe for use in semiconductor IC chip packageICOMETRUE CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·28 claims
- 1157US12555628B2Multi-output look-up table (LUT) for use in coarse-grained field-programmable-gate-array (FPGA) integrated-circuit (IC) chipICOMETRUE CO LTD·Filed 2022·Granted Feb 17, 2026·0 cites·21 claims
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Identity basis: exact name match across USPTO filings. How scoring works →