Inventor · name-matched record

LIN YU-JIE

1 granted patent·1 pending application·0 citations·filing 2022–2024

7Inventor score

Technology areasH10W

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

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2 records

0154US2026005138A1Package structure and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
0252US12525566B2Semiconductor package and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jan 13, 2026·0 cites·18 claims

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Identity basis: exact name match across USPTO filings. How scoring works →