Inventor · name-matched record
PARK BEOMJIN
4 granted patents·9 pending applications·0 citations·filing 2022–2025
53Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
13 records- 0181US2026082633A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0265US12543345B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 3, 2026·0 cites·9 claims
- 0358US12598751B2Semiconductor devices and data storage systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 0457US2026076117A1Method for doping molybdenum disulfide thin film with aluminum nitride, and aluminum nitride for the sameUNIV SEOUL IND COOP FOUND·Filed 2024·Application pending·0 cites
- 0554US12575135B2Semiconductor devices including gate-all-around type field effect transistorSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 10, 2026·0 cites·17 claims
- 0654US2026040667A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0754US2026052765A1Integrated circuit devices and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0853US2026026030A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0952US2026101580A1Integrated circuit devices and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1051US12532524B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 20, 2026·0 cites·20 claims
- 1151US2026096193A1Integrated circuit devices including stacked transistors and methods of fabrication the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1248US2026052767A1Integrated circuit devices including stacked transistors having independently adjustable gates, channels, and inner spacers and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1342US2026006852A1Semiconductor device including backside contact plugSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →