Inventor · name-matched record
PARK MIN
1 granted patent·5 pending applications·0 citations·filing 2023–2025
13Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
6 records- 0178US2026046998A1Electronic device comprising printed circuit board including thermal interface materialSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0276USRE50841EElectronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 24, 2026·0 cites·18 claims
- 0376US2026089902A1Electronic device comprising heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0470US2026032802A1Electronic device comprising heat transfer portionSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0567US2026075769A1Electronic device comprising heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0659US2026076217A1Semiconductor package substrate including graphene layer, method of manufacturing the semiconductor package substrate, and semiconductor package including the semiconductor package substrateHAESUNG DS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →