Inventor · name-matched record
TSAI BIN-SIANG
6 granted patents·9 pending applications·0 citations·filing 2022–2025
68Inventor score
Files withUNITED MICROELECTRONICS CORP15
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
15 records- 0196US2026047346A1Method of manufacturing magnetoresistive random access memory (mram) deviceUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0286US2026096169A1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0385US12557557B2Method for fabricating magnetoresistive random access memory (MRAM) deviceUNITED MICROELECTRONICS CORP·Filed 2023·Granted Feb 17, 2026·0 cites·7 claims
- 0485US2026059819A1Semiconductor device and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0584US12527230B2Magnetoresistive random access memory deviceUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jan 13, 2026·0 cites·4 claims
- 0669US12538540B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jan 27, 2026·0 cites·10 claims
- 0769US12532485B2MIM capacitor and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jan 20, 2026·0 cites·18 claims
- 0868US12598998B2Interposer having inductor coil pattern embedded in buffer layer and fabrication thereofUNITED MICROELECTRONICS CORP·Filed 2023·Granted Apr 7, 2026·0 cites·18 claims
- 0963US2026090346A1Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1062US2026052995A1Wafer-to-wafer bonding structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1161US2026075852A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1261US2026007076A1Structure with mram and inductor and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1360US2026076106A1Semiconductor structure including resistive random access memory and double capacitor and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1454US12563800B2Method for forming ohmic contacts on compound semiconductor devicesUNITED MICROELECTRONICS CORP·Filed 2022·Granted Feb 24, 2026·0 cites·17 claims
- 1554US2026060007A1Semiconductor structure with magnetic tunnel junction and inductorUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when TSAI BIN-SIANG files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →