Inventor · name-matched record
WONG MERRETT
0 granted patents·3 pending applications·0 citations·filing 2023–2023
Files withLAM RES CORP3
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0155US2026090303A1Post etch plasma treatment for reducing sidewall contaminants and roughnessLAM RES CORP·Filed 2023·Application pending·0 cites
- 0253US2026076123A1High aspect ratio etch with a linerLAM RES CORP·Filed 2023·Application pending·0 cites
- 0350US2026052924A1High aspect ratio etch with a non-uniform metal or metalloid containing maskLAM RES CORP·Filed 2023·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →