Inventor · disambiguated record

Todd H. Herder

Also filed as: HERDER TODD H

1 granted patent·211 citations·filing 1994–1994

56Inventor score

Technology areasH10W

Files withMICROELECTRONICS & COMPUTER1

Top patents by PatentIndex Score

1 record

0191US5508228ACompliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming sameMICROELECTRONICS & COMPUTER·Filed 1994·Granted Apr 16, 1996·211 cites·37 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →