Flexible carrier for fluid flow structure

Abstract

An example system includes a flexible carrier and a printhead flow structure. The printhead flow structure includes a flex circuit including a carrier wafer and at least one printhead die electrically coupled to the flex circuit. The carrier wafer is bonded to the flexible carrier with thermal release tape, the thermal release tape to debond substantially completely from the flex circuit at a debonding temperature via bending of the flexible carrier.

What is claimed is: 
     
       1. A system, comprising:
 a flexible carrier; and 
 a printhead flow structure comprising:
 a flex circuit including a carrier wafer, wherein the carrier wafer is bonded to the flexible carrier with thermal release tape, the thermal release tape to debond substantially completely from the flex circuit at a debonding temperature via bending of the flexible carrier; and 
 at least one printhead die electrically coupled to the flex circuit. 
 
 
     
     
       2. The system of  claim 1 , wherein the flexible carrier includes an elastomer material. 
     
     
       3. The system of  claim 1 , wherein the printhead flow structure includes a plurality of printhead dies molded into an elongated, monolithic body. 
     
     
       4. The system of  claim 1 , wherein the flexible carrier includes a cured epoxy composition. 
     
     
       5. The system of  claim 1 , wherein the printhead die includes at least one electrical terminal coupled to the flex circuit. 
     
     
       6. The system of  claim 1 , wherein the printhead flow structure further comprises:
 a molding forming at least one fluid supply channel fluidly coupled to the printhead die. 
 
     
     
       7. The system of  claim 6 , wherein the molding partially encapsulates the printhead die. 
     
     
       8. The system of  claim 1 , wherein the thermal release tape is to debond at a temperature in a range of from 18° Celsius (C.) to 160° C. 
     
     
       9. The system of  claim 1 , wherein the printhead die includes at least one port to allow fluid to flow from the fluid supply channel into the printhead die.