Shielded module having compression overmold

Abstract

A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, and forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding that includes reducing a volume of melted resin in a direction having a component perpendicular to a plane defined by the packaging substrate.

What is claimed is: 
     
       1. A method for fabricating a radio-frequency (RF) module, the method comprising:
 forming or providing a first assembly that includes a packaging substrate and a radio-frequency component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the radio-frequency component; and 
 forming an overmold over the packaging substrate to substantially encapsulate the radio-frequency component and the one or more shielding-wirebonds, the overmold formed by compression molding, the forming the overmold including mounting the first assembly to an upper molding plate to yield a second assembly in which the radio-frequency component and the one or more shielding-wirebonds are facing downward of the upper molding plate. 
 
     
     
       2. The method of  claim 1  wherein the forming of the overmold further includes lining a molding cavity with a release film. 
     
     
       3. The method of  claim 2  wherein the forming of the overmold further includes lowering the second assembly into the molding cavity having a volume of melted resin. 
     
     
       4. The method of  claim 3  wherein the lowering of the second assembly includes a substantially vertical motion to reduce or eliminate lateral sweeping of the one or more shielding-wirebonds. 
     
     
       5. The method of  claim 3  wherein the forming of the overmold further includes applying vacuum to the volume of melted resin. 
     
     
       6. The method of  claim 5  wherein the vacuum remains applied during at least a portion of reduction of the volume of melted resin. 
     
     
       7. The method of  claim 3  wherein reduction of the volume of melted resin includes moving a floor of the molding cavity upward by an amount resulting in a portion of the one or more shielding-wirebonds engaging the release film. 
     
     
       8. The method of  claim 7  wherein the portion of the one or more shielding-wirebonds deforms the release film upon the engagement to thereby reduce lateral movement of the one or more shielding-wirebonds during the reduction of the volume of melted resin. 
     
     
       9. The method of  claim 3  wherein the forming of the overmold further includes separating the second assembly from the molding cavity, the separated second assembly including the compression molded overmold. 
     
     
       10. The method of  claim 9  further comprising removing the first assembly with the compression molded overmold from the upper molding plate. 
     
     
       11. The method of  claim 10  further comprising forming a conductive layer on an upper surface of the overmold such that the conductive layer is in electrical contact with some or all of the shielding-wirebonds. 
     
     
       12. The method of  claim 11  wherein the forming of the conductive layer includes depositing a metal-based layer on the upper surface of the overmold. 
     
     
       13. A packaged radio-frequency (RF) module comprising:
 a packaging substrate configured to receive one or more components, the packaging substrate including a ground plane; 
 a radio-frequency component mounted on the packaging substrate; 
 one or more shielding-wirebonds implemented on the packaging substrate and relative to the radio-frequency component, each of the one or more shielding-wirebonds electrically connected to the ground plane; 
 an upper molding plate mounted to the packaging substrate, the radio-frequency component and the one or more shielding-wirebonds facing downward of the upper molding plate; 
 a compression overmold structure implemented over the packaging substrate to substantially encapsulate the radio-frequency component and the one or more shielding-wirebonds; and 
 a conductive layer implemented over the compression overmold structure to be in electrical contact with an upper portion of at least one of the one or more shielding-wirebonds, such that the conductive layer is electrically connected to the ground plane. 
 
     
     
       14. The packaged radio-frequency module of  claim 13  wherein an upper portion of the compression overmold structure is removed by one or more ablation techniques to expose upper portions of the shielding-wirebonds before implementation of the conductive layer. 
     
     
       15. The packaged radio-frequency module of  claim 13  wherein the conductive layer is a metal-based layer. 
     
     
       16. The packaged radio-frequency module of  claim 13  wherein each shielding-wirebond is in an arch shape. 
     
     
       17. The packaged radio-frequency module of  claim 13  wherein each shielding-wirebond is a single wire with one end on the packaging substrate and the other end in electrical contact with the conductive layer. 
     
     
       18. A wireless device comprising:
 an antenna; and 
 a module in communication with the antenna, the module configured to facilitate either or both of transmission and reception of radio-frequency signals through the antenna, the module including a packaging substrate having a ground plane, and a radio-frequency component mounted on the packaging substrate, the module further including one or more shielding-wirebonds implemented on the packaging substrate and relative to the radio-frequency component, such that each of the one or more shielding-wirebonds is electrically connected to the ground plane, the module further including an upper molding plate mounted to the packaging substrate such that the radio-frequency component and the one or more shielding-wirebonds face downward of the upper molding plate, the module further including a compression overmold structure implemented over the packaging substrate to substantially encapsulate the radio-frequency component and the one or more shielding-wirebonds, the module further including a conductive layer implemented over the compression overmold structure to be in electrical contact with an upper portion of each of the one or more shielding-wirebonds, such that the conductive layer is electrically connected to the ground plane. 
 
     
     
       19. The wireless device of  claim 18  wherein the conductive layer is a metal-based layer. 
     
     
       20. The wireless device of  claim 18  wherein an upper portion of the compression overmold structure is removed by one or more ablation techniques to expose upper portions of the shielding-wirebonds before implementation of the conductive layer.