Inventor · disambiguated record
Anthony James Lobianco
Also filed as: LOBIANCO ANTHONY · LOBIANCO ANTHONY J · LOBIANCO ANTHONY JAMES
71 granted patents·26 pending applications·1,286 citations·filing 2000–2025
99Inventor score
Files withSKYWORKS SOLUTIONS INC85HOANG DINHPHUOC V4AMKOR TECHNOLOGY INC3AGARWAL ANIL K1CHEN HOWARD E1
Top patents by PatentIndex Score
97 records- 0198US11864295B2Selectively shielded radio frequency module with multi-mode stacked power amplifier stageSKYWORKS SOLUTIONS INC·Filed 2021·Granted Jan 2, 2024·7 cites·20 claims
- 0298US11682649B2Radio frequency modulesSKYWORKS SOLUTIONS INC·Filed 2021·Granted Jun 20, 2023·10 cites·19 claims
- 0398US11037893B2Selectively shielded radio frequency module with linearized low noise amplifierSKYWORKS SOLUTIONS INC·Filed 2020·Granted Jun 15, 2021·14 cites·20 claims
- 0498US10276521B2Front end systems and related devices, integrated circuits, modules, and methodsSKYWORKS SOLUTIONS INC·Filed 2017·Granted Apr 30, 2019·39 cites·20 claims
- 0598US10256535B2Selectively shielding radio frequency module with multi-layer antennaSKYWORKS SOLUTIONS INC·Filed 2017·Granted Apr 9, 2019·18 cites·20 claims
- 0698US10061885B2Racetrack layout for radio frequency isolation structureSKYWORKS SOLUTIONS INC·Filed 2017·Granted Aug 28, 2018·18 cites·20 claims
- 0798US9871599B2Via density in radio frequency shielding applicationsSKYWORKS SOLUTIONS INC·Filed 2015·Granted Jan 16, 2018·30 cites·24 claims
- 0898US9703913B2Racetrack layout for radio frequency shieldingSKYWORKS SOLUTIONS INC·Filed 2016·Granted Jul 11, 2017·21 cites·20 claims
- 0998US9041472B2Power amplifier modules including related systems, devices, and methodsSKYWORKS SOLUTIONS INC·Filed 2013·Granted May 26, 2015·70 cites·29 claims
- 1098US8399972B2Overmolded semiconductor package with a wirebond cage for EMI shieldingHOANG DINHPHUOC V·Filed 2006·Granted Mar 19, 2013·86 cites·18 claims
- 1198US8071431B2Overmolded semiconductor package with a wirebond cage for EMI shieldingHOANG DINHPHUOC V·Filed 2010·Granted Dec 6, 2011·119 cites·26 claims
- 1298US6340846B1Making semiconductor packages with stacked dies and reinforced wire bondsAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 22, 2002·269 cites·21 claims
- 1397US10931009B2Methods for selectively shielding radio frequency modulesSKYWORKS SOLUTIONS INC·Filed 2019·Granted Feb 23, 2021·12 cites·20 claims
- 1497US10530050B2Selectively shielding radio frequency module with multi-layer antennaSKYWORKS SOLUTIONS INC·Filed 2019·Granted Jan 7, 2020·14 cites·20 claims
- 1597US10515924B2Radio frequency modulesSKYWORKS SOLUTIONS INC·Filed 2018·Granted Dec 24, 2019·18 cites·20 claims
- 1697US10320071B2Methods for selectively shielding radio frequency modulesSKYWORKS SOLUTIONS INC·Filed 2017·Granted Jun 11, 2019·14 cites·22 claims
- 1797US10283859B2Selective shielding of radio frequency modulesSKYWORKS SOLUTIONS INC·Filed 2017·Granted May 7, 2019·16 cites·21 claims
- 1897US10200077B2Shielded diversity receive moduleSKYWORKS SOLUTIONS INC·Filed 2017·Granted Feb 5, 2019·24 cites·16 claims
- 1997US9646936B2Intramodule radio frequency isolationSKYWORKS SOLUTIONS INC·Filed 2015·Granted May 9, 2017·15 cites·20 claims
- 2097US9515029B2Radio frequency module including segmented conductive top layerSKYWORKS SOLUTIONS INC·Filed 2015·Granted Dec 6, 2016·15 cites·20 claims
- 2197US9295157B2Racetrack design in radio frequency shielding applicationsSKYWORKS SOLUTIONS INC·Filed 2013·Granted Mar 22, 2016·22 cites·20 claims
- 2296US10615841B2Conformal shielding for a diversity receive moduleSKYWORKS SOLUTIONS INC·Filed 2019·Granted Apr 7, 2020·14 cites·20 claims
- 2396US9214387B2Systems and methods for providing intramodule radio frequency isolationSKYWORKS SOLUTIONS INC·Filed 2013·Granted Dec 15, 2015·15 cites·20 claims
- 2496US9202747B2Segmented conductive top layer for radio frequency isolationSKYWORKS SOLUTIONS INC·Filed 2013·Granted Dec 1, 2015·20 cites·20 claims
- 2596US8948712B2Via density and placement in radio frequency shielding applicationsCHEN HOWARD E·Filed 2012·Granted Feb 3, 2015·75 cites·29 claims
- 2695US11894323B2Devices related to dual-sided module with land-grid array (LGA) footprintSKYWORKS SOLUTIONS INC·Filed 2021·Granted Feb 6, 2024·2 cites·20 claims
- 2795US11563267B2Methods for electromagnetic shielding using an outer cobalt layerSKYWORKS SOLUTIONS INC·Filed 2021·Granted Jan 24, 2023·2 cites·23 claims
- 2895US11043466B2Radio frequency modulesSKYWORKS SOLUTIONS INC·Filed 2019·Granted Jun 22, 2021·9 cites·20 claims
- 2995US9203529B2Via placement in radio frequency shielding applicationsSKYWORKS SOLUTIONS INC·Filed 2014·Granted Dec 1, 2015·19 cites·19 claims
- 3094US11974390B2Reduction of packaging substrate deformationSKYWORKS SOLUTIONS INC·Filed 2023·Granted Apr 30, 2024·2 cites·18 claims
- 3194US10497656B2Dual-sided module with land-grid array (LGA) footprintSKYWORKS SOLUTIONS INC·Filed 2018·Granted Dec 3, 2019·8 cites·16 claims
- 3294US9419667B2Apparatus and methods related to conformal coating implemented with surface mount devicesSKYWORKS SOLUTIONS INC·Filed 2014·Granted Aug 16, 2016·15 cites·20 claims
- 3394US9041168B2Overmolded semiconductor package with wirebonds for electromagnetic shieldingHOANG DINHPHUOC V·Filed 2011·Granted May 26, 2015·15 cites·20 claims
- 3493US10192785B2Devices and methods related to fabrication of shielded modulesSKYWORKS SOLUTIONS INC·Filed 2016·Granted Jan 29, 2019·8 cites·16 claims
- 3593US7629201B2Method for fabricating a wafer level package with device wafer and passive component integrationSKYWORKS SOLUTIONS INC·Filed 2007·Granted Dec 8, 2009·27 cites·20 claims
- 3693US7576426B2Wafer level package including a device wafer integrated with a passive componentSKYWORKS SOLUTIONS INC·Filed 2005·Granted Aug 18, 2009·31 cites·16 claims
- 3792US11139257B2Methods related to dual-sided module with land-grid array (LGA) footprintSKYWORKS SOLUTIONS INC·Filed 2019·Granted Oct 5, 2021·5 cites·15 claims
- 3892US10980106B2Apparatus related to conformal coating implemented with surface mount devicesSKYWORKS SOLUTIONS INC·Filed 2019·Granted Apr 13, 2021·5 cites·13 claims
- 3992US10524350B2Apparatus and methods related to conformal coating implemented with surface mount devicesSKYWORKS SOLUTIONS INC·Filed 2016·Granted Dec 31, 2019·6 cites·17 claims
- 4092US10242143B2Radio frequency isolation structure with racetrackSKYWORKS SOLUTIONS INC·Filed 2016·Granted Mar 26, 2019·6 cites·20 claims
- 4192US9071335B2Radio-frequency modules having tuned shielding-wirebondsAGARWAL ANIL K·Filed 2012·Granted Jun 30, 2015·16 cites·19 claims
- 4291US11063002B2Methods related to shielded module having compression overmoldSKYWORKS SOLUTIONS INC·Filed 2020·Granted Jul 13, 2021·3 cites·13 claims
- 4391US10579766B2Radio frequency isolation structureSKYWORKS SOLUTIONS INC·Filed 2019·Granted Mar 3, 2020·4 cites·21 claims
- 4490US11038267B2Apparatus and methods for electromagnetic shielding using an outer cobalt layerSKYWORKS SOLUTIONS INC·Filed 2019·Granted Jun 15, 2021·4 cites·29 claims
- 4590US10586010B2Methods of determining racetrack layout for radio frequency isolation structureSKYWORKS SOLUTIONS INC·Filed 2018·Granted Mar 10, 2020·4 cites·23 claims
- 4690US10580741B2Semiconductor package having a metal paint layerSKYWORKS SOLUTIONS INC·Filed 2018·Granted Mar 3, 2020·4 cites·18 claims
- 4790US9202748B2Segmented conductive ground plane for radio frequency isolationSKYWORKS SOLUTIONS INC·Filed 2013·Granted Dec 1, 2015·7 cites·20 claims
- 4889US10529669B2Shielded module having compression overmoldSKYWORKS SOLUTIONS INC·Filed 2018·Granted Jan 7, 2020·6 cites·20 claims
- 4989US9252107B2Semiconductor package having a metal paint layerSKYWORKS SOLUTIONS INC·Filed 2013·Granted Feb 2, 2016·7 cites·20 claims
- 5089US9054115B2Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shieldingHOANG DINHPHUOC V·Filed 2011·Granted Jun 9, 2015·7 cites·23 claims
Showing the top 50 of 97 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →